DRV5055 Datasheet by Texas Instruments

U Ordering & Technical Design a E Suppon s . . quahly documentation development (raming TEXAS INSTRUMENTS v VCC Vuvwm 7; 0V VLW
DRV5055 Ratiometric Linear Hall Effect Sensor
1 Features
Ratiometric Linear Hall Effect Magnetic Sensor
Operates From 3.3-V and 5-V Power Supplies
Analog Output With VCC / 2 Quiescent Offset
Magnetic Sensitivity Options (At VCC = 5 V):
A1/Z1: 100 mV/mT, ±21-mT Range
A2/Z2: 50 mV/mT, ±42-mT Range
A3/Z3: 25 mV/mT, ±85-mT Range
A4/Z4: 12.5 mV/mT, ±169-mT Range
Fast 20-kHz Sensing Bandwidth
Low-Noise Output With ±1-mA Drive
Compensation For Magnet Temperature Drift for
A1/A2/A3/A4 Versions and None for Z1/Z2/Z3/Z4
Versions
Standard Industry Packages:
Surface-Mount SOT-23
Through-Hole TO-92
2 Applications
Precise Position Sensing
Industrial Automation and Robotics
Home Appliances
Gamepads, Pedals, Keyboards, Triggers
Height Leveling, Tilt and Weight Measurement
Fluid Flow Rate Measurement
Medical Devices
Absolute Angle Encoding
Current Sensing
3 Description
The DRV5055 is a linear Hall effect sensor that
responds proportionally to magnetic flux density. The
device can be used for accurate position sensing in a
wide range of applications.
The device operates from 3.3-V or 5-V power
supplies. When no magnetic field is present, the
analog output drives half of VCC. The output changes
linearly with the applied magnetic flux density, and
four sensitivity options enable maximal output voltage
swing based on the required sensing range. North
and south magnetic poles produce unique voltages.
Magnetic flux perpendicular to the top of the package
is sensed, and the two package options provide
different sensing directions.
The device uses a ratiometric architecture that can
eliminate error from VCC tolerance when the external
analog-to-digital converter (ADC) uses the same VCC
for its reference. Additionally, the device features
magnet temperature compensation to counteract how
magnets drift for linear performance across a wide
40°C to 125°C temperature range. Device options for
no temperature compensation of magnet drift are also
available.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
DRV5055 SOT-23 (3) 2.92 mm × 1.30 mm
TO-92 (3) 4.00 mm × 3.15 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
OUT
DRV5055
VCC
Controller
VCC
GND
ADC
Typical Schematic
B
southnorth
OUT
0 mT
0 V
VCC
VL (MIN)
VL (MAX)
VCC / 2
Magnetic Response
www.ti.com
DRV5055
SBAS640B JANUARY 2018 REVISED APRIL 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 1
Product Folder Links: DRV5055
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
I TEXAS INSTRUMENTS
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Magnetic Characteristics.............................................5
6.7 Typical Characteristics................................................6
7 Detailed Description........................................................9
7.1 Overview.....................................................................9
7.2 Functional Block Diagram...........................................9
7.3 Feature Description.....................................................9
7.4 Device Functional Modes..........................................13
8 Application and Implementation..................................14
8.1 Application Information............................................. 14
8.2 Typical Application.................................................... 15
8.3 Do's and Don'ts.........................................................17
9 Power Supply Recommendations................................18
10 Layout...........................................................................18
10.1 Layout Guidelines................................................... 18
10.2 Layout Examples.................................................... 18
11 Device and Documentation Support..........................19
11.1 Documentation Support.......................................... 19
11.2 Receiving Notification of Documentation Updates.. 19
11.3 Support Resources................................................. 19
11.4 Trademarks............................................................. 19
11.5 Electrostatic Discharge Caution.............................. 19
11.6 Glossary.................................................................. 19
12 Mechanical, Packaging, and Orderable
Information.................................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (June 2020) to Revision B (April 2021) Page
Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Changed the absolute maximum operating junction temperature from: 150°C to: 170°C..................................4
Removed the Product Preview tablenote from the Magnetic Characteristics table............................................ 5
Changes from Revision * (January 2018) to Revision A (June 2020) Page
Added Zero TC sensitivity options to the data sheet.......................................................................................... 1
Added Zero TC information to the Electrical Characteristics .............................................................................5
Added Zero TC information to the Magnetic Characteristics table..................................................................... 5
Added graphs for DV5055Z1/Z2/Z3/Z4 options in the Typical Characteristics section.......................................6
Updated STC definition in Equation 1 ...............................................................................................................10
Updated the Sensitivity Temperature Compensation for Magnets section for Zero TC options....................... 12
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021 www.ti.com
2Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: DRV5055
I TEXAS INSTRUMENTS
5 Pin Configuration and Functions
GND
VCC
OUT
1
2
3
Figure 5-1. DBZ Package 3-Pin SOT-23 Top View
GND OUTVCC
1 2 3
Figure 5-2. LPG Package 3-Pin TO-92 Top View
Table 5-1. Pin Functions
PIN I/O DESCRIPTION
NAME SOT-23 TO-92
VCC 1 1 Power supply. TI recommends connecting this pin to a ceramic capacitor to ground
with a value of at least 0.01 µF.
OUT 2 3 O Analog output
GND 3 2 Ground reference
www.ti.com
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 3
Product Folder Links: DRV5055
TEXAS INSTRUMENTS
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power supply voltage VCC –0.3 7 V
Output voltage OUT –0.3 VCC + 0.3 V
Magnetic flux density, BMAX Unlimited T
Operating junction temperature, TJ–40 170 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE UNIT
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC
JS-001(1) ±2500
V
Charged-device model (CDM), per JEDEC specification
JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Power-supply voltage(1) 3 3.63 V
4.5 5.5
IOOutput continuous current –1 1 mA
TAOperating ambient temperature(2) –40 125 °C
(1) There are two isolated operating VCC ranges. For more information see the Operating VCC Ranges section.
(2) Power dissipation and thermal limits must be observed.
6.4 Thermal Information
THERMAL METRIC(1)
DRV5055
UNITSOT-23 (DBZ) TO-92 (LPG)
3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 170 121 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66 67 °C/W
RθJB Junction-to-board thermal resistance 49 97 °C/W
YJT Junction-to-top characterization parameter 1.7 7.6 °C/W
YJB Junction-to-board characterization parameter 48 97 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021 www.ti.com
4Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: DRV5055
TEXAS INSTRUMENTS
6.5 Electrical Characteristics
for VCC = 3 V to 3.63 V and 4.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
ICC Operating supply current 6 10 mA
tON Power-on time (see Figure 7-4) B = 0 mT, no load on OUT 175 330 µs
fBW Sensing bandwidth 20 kHz
tdPropagation delay time From change in B to change in OUT 10 µs
BND Input-referred RMS noise density VCC = 5 V 130 nT/√ Hz
VCC = 3.3 V 215
BNInput-referred noise BND × 6.6 × √ 20 kHz VCC = 5 V 0.12 mTPP
VCC = 3.3 V 0.2
VNOutput-referred noise(2) BN × S
DRV5055A1/Z1 12
mVPP
DRV5055A2/Z2 6
DRV5055A3/Z3 3
DRV5055A4/Z4 1.5
(1) B is the applied magnetic flux density.
(2) VN describes voltage noise on the device output. If the full device bandwidth is not needed, noise can be reduced with an RC filter.
6.6 Magnetic Characteristics
for VCC = 3 V to 3.63 V and 4.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
VQQuiescent voltage B = 0 mT, TA = 25°C VCC = 5 V 2.43 2.5 2.57 V
VCC = 3.3 V 1.59 1.65 1.71
VQΔT Quiescent voltage temperature drift B = 0 mT,
TA = –40°C to 125°C versus 25°C ±1% × VCC V
VQRE Quiescent voltage ratiometry error(2) ±0.2%
VQΔL Quiescent voltage lifetime drift High-temperature operating stress for
1000 hours < 0.5%
SSensitivity
VCC = 5 V,
TA = 25°C
DRV5055A1/Z1 95 100 105
mV/mT
DRV5055A2/Z2 47.5 50 52.5
DRV5055A3/Z3 23.8 25 26.2
DRV5055A4/Z4 11.9 12.5 13.2
VCC = 3.3 V,
TA = 25°C
DRV5055A1/Z1 57 60 63
DRV5055A2/Z2 28.5 30 31.5
DRV5055A3/Z3 14.3 15 15.8
DRV5055A4/Z4 7.1 7.5 7.9
BLLinear magnetic sensing range(3) (4)
VCC = 5 V,
TA = 25°C
DRV5055A1/Z1 ±21
mT
DRV5055A2/Z2 ±42
DRV5055A3/Z3 ±85
DRV5055A4/Z4 ±169
VCC = 3.3 V,
TA = 25°C
DRV5055A1/Z1 ±22
DRV5055A2/Z2 ±44
DRV5055A3/Z3 ±88
DRV5055A4/Z4 ±176
VLLinear range of output voltage(4) 0.2 VCC – 0.2 V
STC Sensitivity temperature compensation
for magnets(5) DRV5055A1, DRV5055A2,
DRV5055A3, DRV5055A4 0.12 %/°C
www.ti.com
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 5
Product Folder Links: DRV5055
TEXAS INSTRUMENTS cc 26 140 28 2s
for VCC = 3 V to 3.63 V and 4.5 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
STCz Sensitivity temperature compensation
for magnets(5) DRV5055Z1, DRV5055Z2,
DRV5055Z3, DRV5055Z4 0 %/°C
SLE Sensitivity linearity error(4) VOUT is within VL±1%
SSE Sensitivity symmetry error(4) VOUT is within VL±1%
SRE Sensitivity ratiometry error(2) TA = 25°C,
with respect to VCC = 3.3 V or 5 V –2.5% 2.5%
SΔL Sensitivity lifetime drift High-temperature operating stress for
1000 hours <0.5%
(1) B is the applied magnetic flux density.
(2) See the Ratiometric Architecture section.
(3) BL describes the minimum linear sensing range at 25°C taking into account the maximum VQ and Sensitivity tolerances.
(4) See the Sensitivity Linearity section.
(5) STC describes the rate the device increases Sensitivity with temperature. For more information, see the Sensitivity Temperature
Compensation for Magnets section.
6.7 Typical Characteristics
for TA = 25°C (unless otherwise noted)
Temperature (qC)
Quiescent Voltage (V)
-40 -20 0 20 40 60 80 100 120 140
1.6
1.8
2
2.2
2.4
2.6
D002
VCC = 3.3 V
VCC = 5 V
DRV5055A1/A2/A3/A4
Figure 6-1. Quiescent Voltage vs. Temperature
Temperature (qC)
Quiescent Voltage (V)
-40 -20 0 20 40 60 80 100 120 140
1.6
1.8
2
2.2
2.4
2.6
VCC = 3.3 V
VCC = 5 V
DRV5055Z1/Z2/Z3/Z4
Figure 6-2. Quiescent Voltage vs. Temperature
Supply Voltage (V)
Quiescent Voltage (V)
3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
D003
DRV5055A1/A2/A3/A4
Figure 6-3. Quiescent Voltage vs. Supply Voltage
Supply Voltage (V)
Quiescent Voltage (V)
3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
DRV5055Z1/Z2/Z3/AZ
Figure 6-4. Quiescent Voltage vs. Supply Voltage
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021 www.ti.com
6Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: DRV5055
TEXAS INSTRUMENTS 120 140 12a 140 120
6.7 Typical Characteristics (continued)
for TA = 25°C (unless otherwise noted)
VCC = 3.3 V
Figure 6-5. Sensitivity vs. Temperature
Temperature (qC)
Sensitivity (mV/mT)
-40 -20 0 20 40 60 80 100 120 140
0
20
40
60
80
100
120
D005
DRV5055A1
DRV5055A2
DRV5055A3
DRV5055A4
VCC = 5 V
Figure 6-6. Sensitivity vs. Temperature
Temperature (qC)
Sensitivity (mV/mT)
-40 -20 0 20 40 60 80 100 120 140
0
20
40
60
80
DRV5055Z1
DRV5055Z2
DRV5055Z3
DRV5055Z4
VCC = 3.3 V
Figure 6-7. Sensitivity vs. Temperature
Temperature (qC)
Sensitivity (mV/mT)
-40 -20 0 20 40 60 80 100 120 140
0
20
40
60
80
100
120
DRV5055Z1
DRV5055Z2
DRV5055Z3
DRV5055Z4
VCC = 5 V
Figure 6-8. Sensitivity vs. Temperature
Supply Voltage (V)
Sensitivity (mV/mT)
3 3.1 3.2 3.3 3.4 3.5 3.6
5
10
15
20
25
30
35
40
45
50
55
60
65
70
D006
DRV5055A1
DRV5055A2
DRV5055A3
DRV5055A4
VCC = 3.3 V ±10%
Figure 6-9. Sensitivity vs. Supply Voltage
Supply Voltage (V)
Sensitivity (mV/mT)
4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5
0
20
40
60
80
100
120
D007
DRV055A1
DRV055A2
DRV055A3
DRV055A4
VCC = 5 V ±10%
Figure 6-10. Sensitivity vs. Supply Voltage
www.ti.com
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 7
Product Folder Links: DRV5055
l TEXAS INSTRUMENTS 120 b6
6.7 Typical Characteristics (continued)
for TA = 25°C (unless otherwise noted)
Supply Voltage (V)
Sensitivity (mV/mT)
3 3.1 3.2 3.3 3.4 3.5 3.6
5
10
15
20
25
30
35
40
45
50
55
60
65
70
DRV5055Z1
DRV5055Z2
DRV5055Z3
DRV5055Z4
VCC = 3.3 V ±10%
Figure 6-11. Sensitivity vs. Supply Voltage
Supply Voltage (V)
Sensitivity (mV/mT)
4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5
0
20
40
60
80
100
120
DRV055Z1
DRV055Z2
DRV055Z3
DRV055Z4
VCC = 5 V ±10%
Figure 6-12. Sensitivity vs. Supply Voltage
Temperature (qC)
Operating Supply Current (mA)
-40 -20 0 20 40 60 80 100 120 140
5.2
5.4
5.6
5.8
6
6.2
6.4
6.6
D001
VCC = 3.3 V
VCC = 5 V
Figure 6-13. Operating Supply Current vs. Temperature
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021 www.ti.com
8Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: DRV5055
Q; TEXAS INSTRUMENTS
7 Detailed Description
7.1 Overview
The DRV5055 is a 3-pin linear Hall effect sensor with fully integrated signal conditioning, temperature
compensation circuits, mechanical stress cancellation, and amplifiers. The device operates from 3.3-V and
5-V (±10%) power supplies, measures magnetic flux density, and outputs a proportional analog voltage that is
referenced to VCC.
7.2 Functional Block Diagram
0.01 F
(minimum)
VCC
Output
Driver
OUT
GND
VCC
Optional filter
Element Bias
Offset
Cancellation
Temperature
Compensation
Precision
Amplifier
Bandgap
Reference
Trim
Registers
7.3 Feature Description
7.3.1 Magnetic Flux Direction
As shown in Figure 7-1, the DRV5055 is sensitive to the magnetic field component that is perpendicular to the
top of the package.
PCB
SOT-23
B
B
TO-92
Figure 7-1. Direction of Sensitivity
www.ti.com
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 9
Product Folder Links: DRV5055
INSTRUMENTS )))
Magnetic flux that travels from the bottom to the top of the package is considered positive in this document. This
condition exists when a south magnetic pole is near the top (marked-side) of the package. Magnetic flux that
travels from the top to the bottom of the package results in negative millitesla values.
PCBPCB
N
S
NS
Figure 7-2. The Flux Direction for Positive B
7.3.2 Magnetic Response
When the DRV5055 is powered, the DRV5055 outputs an analog voltage according to Equation 1:
VOUT = VQ + B × Sensitivity(25° C) × (1 + STC × (TA ± 25° C))
()
(1)
where
• VQ is typically half of VCC
B is the applied magnetic flux density
• Sensitivity(25°C) depends on the device option and VCC
• STC is typically 0.12%/°C for device options DRV5055A1 - DRV5055A4 and is 0%/°C for DRV5055Z1 -
DRV5055Z4 options
• TA is the ambient temperature
• VOUT is within the VL range
As an example, consider the DRV5055A3 with VCC = 3.3 V, a temperature of 50°C, and 67 mT applied.
Excluding tolerances, VOUT = 1650 mV + 67 mT × (15 mV/mT × (1 + 0.0012/°C × (50°C – 25°C))) = 2685 mV.
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021 www.ti.com
10 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: DRV5055
I TEXAS INSTRUMENTS V CC VLflMAX) VLqu) DB V B X} S 00
7.3.3 Sensitivity Linearity
The device produces a linear response when the output voltage is within the specified VL range. Outside this
range, sensitivity is reduced and nonlinear. Figure 7-3 graphs the magnetic response.
B
southnorth
OUT
0 mT
0 V
VCC
VL (MIN)
VL (MAX)
VCC / 2
Figure 7-3. Magnetic Response
Equation 2 calculates parameter BL, the minimum linear sensing range at 25°C taking into account the maximum
quiescent voltage and sensitivity tolerances.
VL(MAX) ± VQ(MAX)
S(MAX)
BL(MIN) =
(2)
The parameter SLE defines linearity error as the difference in sensitivity between any two positive B values, and
any two negative B values, while the output is within the VL range.
The parameter SSE defines symmetry error as the difference in sensitivity between any positive B value and the
negative B value of the same magnitude, while the output voltage is within the VL range.
7.3.4 Ratiometric Architecture
The DRV5055 has a ratiometric analog architecture that scales the quiescent voltage and sensitivity linearly with
the power-supply voltage. For example, the quiescent voltage and sensitivity are 5% higher when VCC = 5.25
V compared to VCC = 5 V. This behavior enables external ADCs to digitize a consistent value regardless of the
power-supply voltage tolerance, when the ADC uses VCC as its reference.
Equation 3 calculates the sensitivity ratiometry error:
S(VCC) / S(3.3V)
1 ±
VCC / 3.3V
SRE = for VCC = 3 V to 3.63 V
S(VCC) / S(5V)
1 ±
VCC / 5V
SRE = for VCC = 4.5 V to 5.5 V,
(3)
where
• S(VCC) is the sensitivity at the current VCC voltage
• S(5V) or S(3.3V) is the sensitivity when VCC = 5 V or 3.3 V
• VCC is the current VCC voltage
www.ti.com
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 11
Product Folder Links: DRV5055
l TEXAS INSTRUMENTS CC)/v cc
Equation 4 calculates quiescent voltage ratiometry error:
VQ(VCC) / VQ(3.3V)
1 ±
VCC / 3.3V
VQRE = for VCC = 3 V to 3.63 V
VQ(VCC) / VQ(5V)
1 ±
VCC / 5V
VQRE = for VCC = 4.5 V to 5.5 V,
(4)
where
• VQ(VCC) is the quiescent voltage at the current VCC voltage
• VQ(5V) or VQ(3.3V) is the quiescent voltage when VCC = 5 V or 3.3 V
• VCC is the current VCC voltage
7.3.5 Operating VCC Ranges
The DRV5055 has two recommended operating VCC ranges: 3 V to 3.63 V and 4.5 V to 5.5 V. When VCC is
in the middle region between 3.63 V to 4.5 V, the device continues to function, but sensitivity is less known
because there is a crossover threshold near 4 V that adjusts device characteristics.
7.3.6 Sensitivity Temperature Compensation for Magnets
Magnets generally produce weaker fields as temperature increases. The DRV5055 can either compensate by
increasing sensitivity with temperature or by keeping the sensitivity constant, as defined by the parameters STC
and STCz, respectively. For device options DRV5055A1 - DRV5055A4, the sensitivity at TA = 125°C is typically
12% higher than at TA = 25°C. For device options DRV5055Z1 - DRV5055Z4, the sensitivity at TA = 125°C is
typically same as the value at TA = 25°C.
7.3.7 Power-On Time
After the VCC voltage is applied, the DRV5055 requires a short initialization time before the output is set. The
parameter tON describes the time from when VCC crosses 3 V until OUT is within 5% of VQ, with 0 mT applied
and no load attached to OUT. Figure 7-4 shows this timing diagram.
VCC
time
3 V
tON
Output
time
95% × VQ
Invalid
Figure 7-4. tON Definition
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021 www.ti.com
12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: DRV5055
wwwwwwwwwwwwwwwww lllll
7.3.8 Hall Element Location
Figure 7-5 shows the location of the sensing element inside each package option.
SOT-23
Top View
TO-92
Top View
650 µm
±80 µm
SOT-23
Side View
centered
±50 µm
1.61 mm
1.54 mm
2 mm 2 mm
±50 µm 1030 µm
±115 µm
TO-92
Side View
Figure 7-5. Hall Element Location
7.4 Device Functional Modes
The DRV5055 has one mode of operation that applies when the Recommended Operating Conditions are met.
www.ti.com
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 13
Product Folder Links: DRV5055
i TEXAS INSTRUMENTS
8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
8.1.1 Selecting the Sensitivity Option
Select the highest DRV5055 sensitivity option that can measure the required range of magnetic flux density, so
that the output voltage swing is maximized.
Larger-sized magnets and farther sensing distances can generally enable better positional accuracy than very
small magnets at close distances, because magnetic flux density increases exponentially with the proximity to a
magnet. TI created an online tool to help with simple magnet calculations at https://www.ti.com/product/drv5013.
8.1.2 Temperature Compensation for Magnets
The DRV5055 temperature compensation is designed to directly compensate the average drift of neodymium
(NdFeB) magnets and partially compensate ferrite magnets. The residual induction (Br) of a magnet typically
reduces by 0.12%/°C for NdFeB, and 0.20%/°C for ferrite. When the operating temperature of a system is
reduced, temperature drift errors are also reduced.
8.1.3 Adding a Low-Pass Filter
As shown in Functional Block Diagram, an RC low-pass filter can be added to the device output for the
purpose of minimizing voltage noise when the full 20-kHz bandwidth is not needed. This filter can improve the
signal-to-noise ratio (SNR) and overall accuracy. Do not connect a capacitor directly to the device output without
a resistor in between because doing so can make the output unstable.
8.1.4 Designing for Wire Break Detection
Some systems must detect if interconnect wires become open or shorted. The DRV5055 can support this
function.
First, select a sensitivity option that causes the output voltage to stay within the VL range during normal
operation. Second, add a pullup resistor between OUT and VCC. TI recommends a value between 20 to
100 kΩ, and the current through OUT must not exceed the IO specification, including current going into an
external ADC. Then, if the output voltage is ever measured to be within 150 mV of VCC or GND, a fault condition
exists. Figure 8-1 shows the circuit, and Table 8-1 describes fault scenarios.
OUT
DRV5055
VCC
GND
VCC
Cable
PCB
VOUT
Figure 8-1. Wire Fault Detection Circuit
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021 www.ti.com
14 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: DRV5055
I TEXAS INSTRUMENTS VOUT
Table 8-1. Fault Scenarios and the Resulting VOUT
FAULT SCENARIO VOUT
VCC disconnects Close to GND
GND disconnects Close to VCC
VCC shorts to OUT Close to VCC
GND shorts to OUT Close to GND
8.2 Typical Application
S N
Figure 8-2. Common Magnet Orientation
8.2.1 Design Requirements
Use the parameters listed in Table 8-2 for this design example.
Table 8-2. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
VCC 5 V
Magnet 15 × 5 × 5 mm NdFeB
Travel distance 12 mm
Maximum B at the sensor at 25°C ±75 mT
Device option DRV5055A3
8.2.2 Detailed Design Procedure
Linear Hall effect sensors provide flexibility in mechanical design, because many possible magnet orientations
and movements produce a usable response from the sensor. Figure 8-2 shows one of the most common
orientations, which uses the full north to south range of the sensor and causes a close-to-linear change in
magnetic flux density as the magnet moves across.
When designing a linear magnetic sensing system, always consider these three variables: the magnet, sensing
distance, and the range of the sensor. Select the DRV5055 with the highest sensitivity that has a BL (linear
magnetic sensing range) that is larger than the maximum magnetic flux density in the application. To determine
the magnetic flux density the sensor receives, TI recommends using magnetic field simulation software, referring
to magnet specifications, and testing.
www.ti.com
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 15
Product Folder Links: DRV5055
>380 mT BED — 3. mT 340 — 360 mT 320 — 340 mT BUD , 320 mT 280 — 30‘] mT 250 — mT 240 , 280 mT 220 — 24D mT ZUD — 220 mT 180 — ZDU mT 160 — mT 140 — 163 mT 120 — NU mT 100 — 12D mT BU — 100 mT EU — 30 mT 40 - 50 mT 20 — 4D mT <20 mt="" density="" plot:="" |a|="">
8.2.3 Application Curve
Figure 8-3 shows the simulated magnetic flux from a NdFeB magnet.
Figure 8-3. Simulated Magnetic Flux
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021 www.ti.com
16 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: DRV5055
{a} TEXAS INSTRUMENTS
8.3 Do's and Don'ts
Because the Hall element is sensitive to magnetic fields that are perpendicular to the top of the package, a
correct magnet approach must be used for the sensor to detect the field. Figure 8-4 shows correct and incorrect
approaches.
CORRECT
S
N
INCORRECT
S
N
SN
SN
Figure 8-4. Correct and Incorrect Magnet Approaches
www.ti.com
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 17
Product Folder Links: DRV5055
+ +
9 Power Supply Recommendations
A decoupling capacitor close to the device must be used to provide local energy with minimal inductance. TI
recommends using a ceramic capacitor with a value of at least 0.01 µF.
10 Layout
10.1 Layout Guidelines
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed-circuit boards, which makes placing the magnet on the
opposite side possible.
10.2 Layout Examples
GND
VCC
OUT
GND OUTVCC
Figure 10-1. Layout Examples
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021 www.ti.com
18 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: DRV5055
I TEXAS INSTRUMENTS Am
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
Texas Instruments, Overview Using Linear Hall Effect Sensors to Measure Angle application brief
Texas Instruments, Incremental Rotary Encoder Design Considerations application brief
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
11.3 Support Resources
TI E2E support forums are an engineer's go-to source for fast, verified answers and design help straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
TI E2E is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
www.ti.com
DRV5055
SBAS640B – JANUARY 2018 – REVISED APRIL 2021
Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 19
Product Folder Links: DRV5055
I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Samples Sample: Sample: Samples Samples Samples Samples Samples Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DRV5055A1QDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55A1
DRV5055A1QDBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55A1
DRV5055A1QLPG ACTIVE TO-92 LPG 3 1000 RoHS & Green SN N / A for Pkg Type -40 to 125 55A1
DRV5055A1QLPGM ACTIVE TO-92 LPG 3 3000 RoHS & Green SN N / A for Pkg Type -40 to 125 55A1
DRV5055A2QDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55A2
DRV5055A2QDBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55A2
DRV5055A2QLPG ACTIVE TO-92 LPG 3 1000 RoHS & Green SN N / A for Pkg Type -40 to 125 55A2
DRV5055A2QLPGM ACTIVE TO-92 LPG 3 3000 RoHS & Green SN N / A for Pkg Type -40 to 125 55A2
DRV5055A3QDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55A3
DRV5055A3QDBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55A3
DRV5055A3QLPG ACTIVE TO-92 LPG 3 1000 RoHS & Green SN N / A for Pkg Type -40 to 125 55A3
DRV5055A3QLPGM ACTIVE TO-92 LPG 3 3000 RoHS & Green SN N / A for Pkg Type -40 to 125 55A3
DRV5055A4QDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55A4
DRV5055A4QDBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55A4
DRV5055A4QLPG ACTIVE TO-92 LPG 3 1000 RoHS & Green SN N / A for Pkg Type -40 to 125 55A4
DRV5055A4QLPGM ACTIVE TO-92 LPG 3 3000 RoHS & Green SN N / A for Pkg Type -40 to 125 55A4
DRV5055Z1QDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55Z1
DRV5055Z1QDBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55Z1
DRV5055Z2QDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55Z2
DRV5055Z2QDBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55Z2
I TEXAS INSTRUMENTS Samples Sample: Sample: Samples
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jan-2021
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DRV5055Z3QDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55Z3
DRV5055Z3QDBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55Z3
DRV5055Z4QDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55Z4
DRV5055Z4QDBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 55Z4
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jan-2021
Addendum-Page 3
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DRV5055 :
Automotive: DRV5055-Q1
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS Reel Dlameter Cavtty AD Dimension destgned to accommodate the component wmth Eu Dimension destgned to accommodate the componenl Iength K0 Dtmenston destgned to accommodate the component thickness 7 w Ovevau with at the earner tape i Pt PIlCh between successtve cavtty cemers i T ReelWidIh(W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE C) O O O C) O O O ispmckeIHuIes —> User Dtrecllnn OI Feed \I/ Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DRV5055A1QDBZR SOT-23 DBZ 3 3000 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A1QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A1QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A1QDBZT SOT-23 DBZ 3 250 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A2QDBZR SOT-23 DBZ 3 3000 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A2QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A2QDBZT SOT-23 DBZ 3 250 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A2QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A3QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A3QDBZR SOT-23 DBZ 3 3000 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A3QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A3QDBZT SOT-23 DBZ 3 250 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A4QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A4QDBZR SOT-23 DBZ 3 3000 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A4QDBZT SOT-23 DBZ 3 250 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055A4QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055Z1QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055Z1QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jan-2021
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DRV5055Z2QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055Z2QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055Z3QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055Z3QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055Z4QDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
DRV5055Z4QDBZT SOT-23 DBZ 3 250 180.0 8.4 3.15 2.77 1.22 4.0 8.0 Q3
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DRV5055A1QDBZR SOT-23 DBZ 3 3000 180.0 180.0 18.0
DRV5055A1QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5055A1QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
DRV5055A1QDBZT SOT-23 DBZ 3 250 180.0 180.0 18.0
DRV5055A2QDBZR SOT-23 DBZ 3 3000 180.0 180.0 18.0
DRV5055A2QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5055A2QDBZT SOT-23 DBZ 3 250 180.0 180.0 18.0
DRV5055A2QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
DRV5055A3QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5055A3QDBZR SOT-23 DBZ 3 3000 180.0 180.0 18.0
DRV5055A3QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jan-2021
Pack Materials-Page 2
I TEXAS INSTRUMENTS
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DRV5055A3QDBZT SOT-23 DBZ 3 250 180.0 180.0 18.0
DRV5055A4QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5055A4QDBZR SOT-23 DBZ 3 3000 180.0 180.0 18.0
DRV5055A4QDBZT SOT-23 DBZ 3 250 180.0 180.0 18.0
DRV5055A4QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
DRV5055Z1QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5055Z1QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
DRV5055Z2QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5055Z2QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
DRV5055Z3QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5055Z3QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
DRV5055Z4QDBZR SOT-23 DBZ 3 3000 213.0 191.0 35.0
DRV5055Z4QDBZT SOT-23 DBZ 3 250 213.0 191.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jan-2021
Pack Materials-Page 3
www.ti.com
PACKAGE OUTLINE
4.1
3.9
3X
15.5
15.1
3X 0.48
0.35 2X 1.27 0.05
3.25
3.05
3X 0.51
0.36
3X 0.55
0.40
2X (45 )
0.86
0.66
1.62
1.42
2.64
2.44
2.68
2.28
5.05
MAX
(0.5425)
3X (0.8)
4221343/C 01/2018
TO-92 - 5.05 mm max heightLPG0003A
TRANSISTOR OUTLINE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
13
123
SCALE 1.300
www.ti.com
EXAMPLE BOARD LAYOUT
TYP
ALL AROUND
0.05 MAX FULL R
TYP
(1.07)
(1.7)
(1.27)
(2.54)
(R0.05) TYP 2X (1.07)
2X (1.7)
3X ( 0.75) VIA
4221343/C 01/2018
TO-92 - 5.05 mm max heightLPG0003A
TRANSISTOR OUTLINE
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:20X
METAL
TYP
OPENING
SOLDER MASK
13
2
2X
METAL
2X
SOLDER MASK
OPENING
www.ti.com
TAPE SPECIFICATIONS
0 1 0 1
12.9
12.5
6.55
6.15
13.0
12.4
2.5 MIN 6.5
5.5
3.8-4.2 TYP
9.5
8.5
19.0
17.5
1 MAX
21
18
0.45
0.35
0.25
0.15
TO-92 - 5.05 mm max heightLPG0003A
TRANSISTOR OUTLINE
4221343/C 01/2018
GENERIC PACKAGE VIEW D32 3 SOT-23 - 1.12 mm max heigm SMALL OUTLINE TRANSISTOR Images above are jusl a represenlalion of the package family, aclual package may vary Refel lo the product dala sheel for package details. I TEXAS INSTRI IMFNTS
4203227/C
I-III
www.ti.com
PACKAGE OUTLINE
C
TYP
0.20
0.08
0.25
2.64
2.10 1.12 MAX
TYP
0.10
0.01
3X 0.5
0.3
TYP
0.6
0.2
1.9
0.95
TYP-80
A
3.04
2.80
B
1.4
1.2
(0.95)
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
0.2 C A B
1
3
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
3X (1.3)
3X (0.6)
(2.1)
2X (0.95)
(R0.05) TYP
4214838/C 04/2017
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
SCALE:15X
PKG
1
3
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
www.ti.com
EXAMPLE STENCIL DESIGN
(2.1)
2X(0.95)
3X (1.3)
3X (0.6)
(R0.05) TYP
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
SYMM
PKG
1
3
2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages,
costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either
on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s
applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated