BGX50A Datasheet by Infineon Technologies

(imeon BGXSOA SOT143 bridge U1 5 TA Ts Ti Tstg Thermal Resistance
2007-03-27
1
BGX50A...
Silicon Switching Diode Array
• Bridge configuration
• High-speed switching diode chip
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
BGX50A
,
, 
" !
, !
, "
Type Package Configuration Marking
BGX50A SOT143 bridge U1s
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR50 V
Peak reverse voltage VRM 70
Forward current IF140 mA
Non-repetitive peak surge forward current IFSM -
Total power dissipation
TS ≤ 74°C
Ptot 210 mW
Junction temperature Tj150 °C
Storage temperature Tstg -65 ... 150
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point2)
BGX50A
RthJS 360 K/W
1Pb-containing package may be available upon special request
2For calculation of RthJA please refer to Application Note Thermal Resistance
(ifineon Electrical Characteristics at TA = 25°C. unless otherwise specified Values min. typ. max. DC Characteristics AC Characteristics
2007-03-27
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BGX50A...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Breakdown voltage V(BR) - - -
Reverse current
VR = 50 V
VR = 50 V, TA = 150 °C
IR
-
-
-
-
0.2
100
µA
Forward voltage
IF = 100 mA
VF- - 1.3 V
AC Characteristics
Diode capacitance
VR = 0 V, f = 1 MHz
CT- - 1.5 pF
Reverse recovery time
IF = 10 mA, IR = 10 mA, measured at IR = 1mA ,
RL = 100 Ω
trr - - 6 ns
Test circuit for reverse recovery time
EHN00019
Ι
F
D.U.T.
Oscillograph
Pulse generator: tp = 100ns, D = 0.05, tr = 0.6ns,
Ri = 50Ω
Oscillograph: R = 50Ω, tr = 0.35ns, C ≤ 1pF
(ifineon
2007-03-27
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BGX50A...
Reverse current IR = ƒ (TA)
VR = Parameter
BGX 50A EHB00146
25V
70V
max.
typ.
5
10
10
1
2
Ι
5
10
10
5
R
3
4
10
nA
5
0 50 100
T
A
˚C 150
V
R
= 70 V
Forward Voltage VF = ƒ (TA)
IF = Parameter
0
0.5
1.0
0 50 100 150
BGX 50A EHB00149
V
T
A
V
F
˚C
Ι
F
= 100 mA
10 mA
1 mA
0.1 mA
Forward current IF = ƒ (VF)
TA = 25°C
0
0
EHB00147BGX 50A
Ι
0.5 1.0 V 1.5
50
100
mA
150
F
F
V
maxtyp
Peak forward current IFM = ƒ (tp)
TA = 25°C
10
EHB00148BGX 50A
-6
-1
10
5
t
D
=
T
p
t
T
p
t
D
=
5
10
0
A
10
1
2
10
10
-5
10
-4
10
-3
10
-2
10
0
s
0.005
0.01
0.02
0.05
0.1
0.2
Ι
FM
(ifineon
2007-03-27
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BGX50A...
Forward current IF = ƒ (TS)
BGX50A
0 15 30 45 60 75 90 105 120 °C 150
TS
0
20
40
60
80
100
120
mA
160
IF
(ifleon m 5 fig U“, + Q E $|:|+ _El 2- EB E II >1; ¢ 4; ~ mm , E
2007-03-27
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BGX50A...
Package SOT143
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
RF s
2005, June
Date code (YM)
BFP181
Type code
56
Pin 1
0.8 0.81.2
0.9 1.1 0.9
1.2
0.8
0.8
0.8
-0.05
+0.1
1.9
1.7
±0.1
2.9
+0.1
-0.05
0.4
0.1 MAX.
12
34
0.25 MB
±0.1
1
10˚ MAX.
0.15 MIN.
0.2 A
M
2.4
±0.15
0.2
10˚ MAX.
A
1.3
±0.1
0...8˚
0.08...0.15
2.6
4
3.15
Pin 1
8
0.2
1.15
B
Manufacturer
(ifleon
2007-03-27
6
BGX50A...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
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Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
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systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.