Mini-Fit Plus HCS Product Spec Datasheet by Molex

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(é) INTERCONNECT SYSTEMS REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC No: DATE: CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS—45750-001
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 1 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
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45750
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001
BWIRKUS BWIRKUS APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
PRODUCT SPECIFICATION FOR
Mini-Fit Plus HCS
INTERCONNECT SYSTEMS
Male Terminal
Plug Housing Receptacle Housing
Female Terminal
Headers for Wire-BoardCrimp Terminals and Housing for Wire-Wire
BMI Style Panel Mount Housings for Wire-Panel, Panel-Panel and Panel-Board
42475
BMI Slide and Lock Receptacle
46012
45750
55575559
5569
44516
BMI Plug Housing
BMI Receptacle w/ Spirals
42474
46015
Vertical Header
Right Angle Header
Product feature designations: REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC No: DATE: CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS—45750-001
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 2 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
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45750
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001
BWIRKUS BWIRKUS APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
42404
BMI Style Headers for Panel-Board or Board-Board
BMI Surface Mount Compatible Style Headers
43810
BMI Right Angle Header
BMI SMC Right Angle Header
TPA Right Angle Header
30070
TPA Series Header and Housings for use with Plus HCS Terminals
30067
46010
87427
BMI Receptacle Header
BMI Vertical Header
46011
SMC Vertical Header
Also available in Right Angle
BMI SMC Vertical Header
44068
TPA Plug Housing
30068
30072
TPA Pin Mounting Ears
43130
TPA Receptacle Housing
CPA Key
30070
Product feature designations:
BMI Blind Mate Interface – features allowing easier alignment in panel-board and board to
board applications.
SMC Surface Mount Compatible - reflow solder temperatures up to 245°C.
TPA Terminal Position Assurance – helps ensure crimp terminals are fully engaged and
prevents terminals from backing out in high vibration applications.
CPA Connector Position Assurance – assures housing cannot be inadvertently disengaged.
) molex’ C MINI-FIT PLUS HCS Sco e Product Descrigtion Agglicable Documents and Sgecifications Packaging Ratings Product Performance Tests and Reguirements Test Seguences REVISION. ECRIECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY. PS-45750-001
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 3 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
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45750
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001
BWIRKUS BWIRKUS APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
MINI-FIT PLUS HCS
TABLE OF CONTENTS
SECTION PAGE
1.0 Scope 4
2.0 Product Description 4-5
2.1 Names and Series Numbers 4
2.2 Dimensions, Materials, Platings, and Markings 5
2.3 Safety Agency Approvals 5
3.0 Applicable Documents and Specifications 5
4.0 Packaging 5
5.0 Ratings 5-6
5.1 Voltage 5
5.2 Applicable Wires 5
5.3 Temperature 5
5.4 Wave Solder Process Temperature 5
5.5 Durability (Mating Cycles) 5
5.6 Maximum Current Carrying Capacities 6
Wire-To-Wire
Wire-To-Board
Board-To-Board
6.0 Product Performance Tests and Requirements 7-9
5.1 Electrical Requirements 7
5.2 Mechanical Requirements 7
5.3 Environmental Requirements 9
7.0 Test Sequences 11-13
) molex’ C Agency Aggroval designations PS -45750-001 REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER CREATED / REVISED av. CHECKED av. APPROVED BY.
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 4 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
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001
BWIRKUS BWIRKUS APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
1.0 SCOPE
This Product Specification covers the electrical, mechanical and environmental performance
requirements for the Mini-Fit Plus HCSTM (High Current System) in 4.20 mm (.165 inch) pitch. The
Mini-Fit Plus HCSTM uses contacts stamped in High Performance Alloy for increased current carrying
capacity, while maintaining properties at elevated operating temperatures. Wire-Wire, Wire-Panel,
Wire-Board, Panel-Panel, Panel-Board, and Board-Board configurations in Tin and Gold plated
systems. Crimp terminals accept 16 to 20 AWG stranded wire.
2.0 PRODUCT DESCRIPTION
2.1 SERIES NUMBERS, DESCRIPTION, SALES DRAWING NUMBERS
Agency Approval designations:
U-UL C-CSA T-TUV
SERIES DESCRIPTION SALES DRAWING TPA BMI SMC AGENCY
APP’L
CRIMP TERMINALS
45750 Female Crimp Terminal SD-46012-001
NA
46012 Male Crimp Terminal SD-45750-001
NA
HOUSINGS
5557 Receptacle Housing SD-5557-003
U,C,T
5559 Plug Housing SD-5559-NP
U,C,T
42475 Panel Mount BMI Plug Housing SD-42475-***1
X
U,C,T
43770 Panel Mount Plug Housing, 36 Ckt SD-43770-001
X
U,C,T
42474 Panel Mount Receptacle Housing SD-42474-****
X
U,C,T
43974 Panel Mount Receptacle Hsg 40 Ckt SD-43974-005
X
U,C,T
44516 Panel Mount Receptacle Housing,
Slide-and-Lock SD-44516-00* X U,C
30067 TPA Receptacle Housing SD-30067-*
X
U,C,T
30068 Panel Mount TPA Plug Housing SD-30068-*
X
X
U,C,T
VERTICAL HEADERS
44068 Vertical BMI SMC Header, solid pin SD-44068-031
X
X
U,C,T
46010 Vertical PCB Receptacle Header SD-46010-001
X
U,C
46011 Vertical BMI Header SD-46011-001
X
U,C
46014 Vertical Header, single row SD-46014-001
U,C
46015 Vertical Header, dual row SD-46015-001
U,C
87427 Vertical SMC Header SD-87427-**4*
X
U,C
RIGHT ANGLE HEADERS
5569 Right Angle Header SD-5569-002
U,C,T
30070 Right Angle TPA Header with
mounting flanges
SD-30070-001 X U,C,T
SDA-30070-****
42404 Right Angle BMI Header SDA-42404-****
X
U,C,T
43810 Right Angle BMI SMC Header SD-43810-0**
X
X
U,C,T
43973 Right Angle Header, 40 Ckt SD-43973-00*
X
X
U,C,T
45567 Right Angle Header, 36 Ckt SD-45567-001
X
U,C
87427 Right Angle SMC Header SD-87427-**0*,
-**1*, -**2* X U,C
) PS -45750-001 REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. DATE. CONN ECTOR SYSTEM DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 5 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
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BWIRKUS BWIRKUS APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
For details regarding dimensions, materials and terminal platings, refer to the appropriate
sales drawings for further information.
2.3 SAFETY AGENCY APPROVALS
UL File: E29179
CSA Certificate: LR19980
TUV Certificate: R72081037
3.0 APPLICABLE STANDARDS AND SPECIFICATIONS
- EIA-364-1000
- Molex solderability specification SMES-152
4.0 PACKAGING
Parts shall be packaged to protect against damage during normal handling, transit and storage. For
details refer to the Packaging Specification as called out on the applicable product Sales Drawing.
5.0 RATINGS
5.1 VOLTAGE
600 Volts AC RMS or 600 Volts DC
5.2 APPLICABLE WIRES
WIRE GAUGE INSULATION DIAMETER
16 AWG 1.80-3.10 millimeters / .071-.122 inches
18-20 AWG 1.65-2.95 millimeters / .065-.116 inches
5.3 TEMPERATURE RATING
Mini-Fit Plus HCS has a field temperature of 65°C and field life rating for 10 years based on
testing per EIA-364-17B, Method A.
5.4 WAVE SOLDER PROCESS TEMPERATURE
Headers with molded pegs: 240°C MAX.
Headers without pegs: 265°C MAX
5.5 DURABILITY (MATING CYCLES)
Tin: 100 cycles
Gold: 250 cycles
Durability ratings established as tested per Durability Test Procedures described by EIA-364-09C
and meet requirements for low level contact resistance and DWV as prescribed per EIA-364-1000
Test Sequence Group 7.
| (E) es 18 24 es 18 24 18 24 REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC No: DATE: CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: PS—45750-001
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 6 of 13
DATE: 2010 /07/15
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
5.6 MAXIMUM CURRENT RATING (AMPERES)**
** Ratings shown represent MAXIMUM current carrying capacity of a fully loaded connector with
all circuits powered. Ratings are based on a 30°C maximum temperature rise limit over ambient
(room temperature). Testing conducted with tinned copper conductor stranded wire. Above
charts are intended as a guideline. Current rating is application dependent. Appropriate de-rating
is required depending on factors such as higher ambient temperature, smaller copper weight of
PCB traces, gross heating from adjacent modules or components and other factors that influence
connector performance.
WIRE-TO-WIRE
Wire Size
Single Row Circuit Sizes
Dual Row Circuit Sizes
3 4 5 2 4 6, 8 10, 12 14, 16, 18
20, 22, 24
16 AWG 13A 12.5A 12A 13A 12A 11A 10.5A 10A 9.5A
18 AWG 11A 10.5A 10A 11A 10A 9A 8.5A 8A 7.5A
20 AWG 9.5A 9A 9A 9.5A 8.5A 8A 7.5A 7A 6.5A
WIRE-TO-BOARD
Wire Size
Single Row Circuit Sizes
Dual Row Circuit Sizes
3 4 5 2 4 6, 8 10, 12 14, 16, 18
20, 22, 24
16 AWG 12.5A 12A 11.5A
12.5A 11.5A 10A 9A 8.5A 8.0A
18 AWG 10.5A 10A 9.5A 10.5A 9.5A 8.5A 8A 7.5A 7A
20 AWG 9A 8.5A 8.5A 9A 8A 7A 6.5A 6A 5.5A
BOARD-TO-BOARD
Dual Row Circuit Sizes
2 4 6, 8 10, 12 14, 16, 18
20, 22, 24
11.5A 11A 9.5A 8A 6.5A 5A
) molex’ C 5 REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER CREATED / REVISED av. CHECKED av. APPROVED BY. PS-45750-OO1
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 7 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
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BWIRKUS BWIRKUS APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
6.0 PRODUCT PERFORMANCE TESTS & REQUIREMENTS
6.1 ELECTRICAL REQUIREMENTS
ITEM
TEST
TEST PROCEDURE
REQUIREMENT
1
Contact
Resistance
(Low Level)
EIA-364-23: Mate connectors; apply a
maximum voltage of 20 mV and a current
of 100 mA. Wire resistance shall be
removed from the measured value.
10 mΩ Maximum Initial
resistance for each test
sequence. Resistance
measurements for subsequent
tests are the Maximum change
from Initial as specified.
2 Insulation
Resistance
Mate connectors: apply a voltage of 500
VDC between adjacent terminals and
between terminals to ground.
1000 Megohms
MINIMUM
3
Dielectric
Withstanding
Voltage
EIA-364-20: Apply a voltage of 1500 VAC
for 1 minute between adjacent contacts.
No breakdown.
Current leakage < 5 mA
4
Temperature Rise
(via Current Cycling)
EIA-364-70 (Temperature Rise) & EIA-364-
55 (Current Cycling): Apply current to
mated connectors & incrementally increase
until specified T-Rise is reached to
establish rated current. Measure the T-Rise
at the rated current after 96 hours, during
current cycling (45 minutes ON and 15
minutes OFF per hour) for 240 hours, and
after final 96-hour steady state.
Temperature rise:
+30°C MAXIMUM
6.2 MECHANICAL REQUIREMENTS
ITEM
TEST
TEST PROCEDURE
REQUIREMENT
1
Terminal Mate /
Unmate Forces
Per Circuit for:
Wire – Wire
;
Wire – Board
(formed pin header);
and
Wire – Board (solid
pin header)
Mate and unmate female to male crimp
terminal or female terminal to header at a
rate of 25 ± 6 mm (1 ± ¼ inch) per minute.
Testing to be conducted with individual
(single) circuit. Measure and record the
maximum mate and unmate forces across 5
mating cycles.
Tin, W-W & W-B (formed pin):
Mate: 15.6 N (3.50 lbf) MAX.
Unmate: 13.8N (3.10 lbf) MAX.
Gold, W-W & W-B (formed pin):
Mate: 4.9 N (1.10 lbf) MAX.
Unmate: 4.0 N (0.91 lbf) MAX.
Tin, W-
B (solid pin):
Mate: 10.5 N (2.36 lbf) MAX.
Unmate: 11.0N (2.47 lbf) MAX.
Gold, W-B (solid pin):
Mate: 3.4 N (0.77 lbf) MAX.
Unmate: 2.8 N (0.63 lbf) MAX.
) molex’ C REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER CREATED / REVISED av. CHECKED av. APPROVED BY. PS-45750-OO1
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 8 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
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BWIRKUS BWIRKUS APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
6.2 MECHANICAL REQUIREMENTS (CON’D)
ITEM
TEST
TEST PROCEDURE
REQUIREMENT
2 Normal
Force
Apply a perpendicular force simultaneously
to each beam until the desired total
deflection is achieved. Return to original
size, then deflect beams a second time and
measure normal force.
3.5 N (360 g) MINIMUM
3 Durability
Per EIA-364-09C, mate connectors 100
cycles for tin plated product, 250 cycles for
gold plated product at a maximum rate of
500 cycles per minute.
10 mΩ Max. chg. from Initial;
Visual: No Damage
4 Durability
(preconditioning)
Mate connectors by hand, 20 cycles for tin
plated product, 50 cycles for gold as
required prior to environmental test
sequence as indicated.
Visual: no damage
5 Reseating Unmate / mate connectors by hand three
cycles. Visual: no damage
6 Vibration
(Random)
EIA 364-28: Mate connectors and vibrate
per, test condition VII.
10 mΩ Max. chg. from Initial;
Discontinuity < 1 microsecond
7
Crimp Terminal
Insertion Force
(into housing)
Apply an axial insertion force on the
terminal at a rate of 25 ± 6 mm (1 ± ¼
inches).
15.0 N (3.37 lbf)
MAXIMUM insertion force
8
Crimp Terminal
Retention Force
(in housing)
Axial pullout force on the terminal in the
housing at a rate of 25 ± 6 mm (1 ± ¼ inch)
per minute.
30 N (6.74 lbf)
MINIMUM retention force
9 Wire Crimp
Retention
Apply an axial pullout force on the wire at a
rate of 25 ± 6 mm (1 ± ¼ inches) per
minute.
16 Awg = 68.4 N (15.4 lbf) Min.
18 Awg = 68.4 N (15.4 lbf) Min.
20 Awg = 58.7 N (13.2 lbf) Min.
10 Thumb Latch
Operation Force
Depress latch at a rate of 25 ± 6mm (1 ± ¼
inches) per minute. 16.7 N (3.75 LBF) MAX.
11 Thumb Latch Yield
Strength
Manually mate and unmate unloaded
housings for 30 cycles. Following the 30th
mate, pull apart housings in an axial
direction at a rate of 25 ± 6mm (1 ± ¼
inches) per minute.
75.2 N (16.9 LBF) MIN.
) molex’ C feaIures only) MIN. wiIhdrawal force REVISION. ECRIECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER CREATED / REVISED av. CHECKED av. APPROVED BY. PS-45750-OO1
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 9 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
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45750
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BWIRKUS BWIRKUS APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
6.2 MECHANICAL REQUIREMENTS (CON’D)
ITEM
TEST TEST PROCEDURE REQUIREMENT
12
Header Solid Pin
Retention Force
in Housing
Axial pullout force on the terminal in the
housing at a rate of 25 ± 6 mm (1 ± ¼ inch)
per minute.
Tin 4.45 N (1.00 lbf)
MINIMUM
Gold 4.45 N (1.00 lbf)
MINIMUM
13
Header Stamped Pin
Retention Force
in Housing
Axial pullout force on terminal from housing
at a rate of 25 ± 6 mm (1 ± ¼ inch) per
minute.
30 N (6.74 lbf)
MINIMUM retention force
14
PCB Peg
Engagement and
Separation Forces
Engage and separate a connector at a rate
of 25 ± 6 mm (1 ± ¼ inch) per minute.
(Applies to parts with PCB retention
features only)
98.0 N (22.0 lbf)
MAX. insertion force;
10.0 N (2.24 lbf)
MIN.
withdrawal force
6.3 ENVIRONMENTAL REQUIREMENTS
ITEM
TEST TEST PROCEDURE REQUIREMENT
1a Temperature Life
Group 1
Per EIA-364-17, method A: mate
connectors and expose to 240 hours at 105
± 2°C.
10 mΩ Max. chg. from Initial;
Visual: No Damage
1b
Temperature Life
(preconditioning)
Groups 3 & 5
Per EIA-364-17, method A: mate
connectors and expose to 120 hours at 105
± 2°C.
10 mΩ Max. chg. from Initial;
Visual: No Damage
1c
Temperature Life
(preconditioning)
Group 4
Per EIA-364-17, method A: mate
connectors and expose to 300 hours at 105
± 2°C.
10 mΩ Max. chg. from Initial;
Visual: No Damage
2 Thermal
Shock
Per EIA-364-32, method A, test condition I,
test duration A-4: mate connectors and
expose for 10 cycles between –55°C and
105° C; dwell 0.5 hours at each
temperature.
10 mΩ Max. chg. from Initial;
Visual: No Damage
Dielectric Strength per 5.1.3
Insulation Resistance per 5.1.2
3 Cyclic Temperature
& Humidity
Per EIA-364-31, method III w/o
conditioning, initial measurements, cold
shock and vibration. Cycle mated
connectors between 25°C ±3°C @ 80%
±3% RH and 65°C ±3°C @ 50% ±3RH.
Ramp time: 0.5 hr.; dwell time: 1 hr.
Perform 24 cycles.
10 mΩ Max. chg. from Initial;
Visual: No Damage
) molex’ C REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER CREATED / REVISED av. CHECKED av. APPROVED BY. PS-45750-OO1
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 10 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
6.3 ENVIRONMENTAL REQUIREMENTS (CON’D)
4 Mixed Flowing Gas
Per EIA-364-65 with Class IIA gas
concentrations following Telcordia
Specification GR1217.
10 mΩ Max. chg. from Initial;
Visual: No Damage
5 Thermal Cycling
Per EIA-364-1000 Test Group 5: Cycle
mated connector between 15°C±3°C and
85°C±3°C as measured on the part. Ramps
should be a minimum of 2°C per minute,
and dwell times should insure contacts
reach the temperature extremes (minimum
of 5 minutes). Humidity is not controlled.
Perform 500 cycles.
10 mΩ Max. chg. from Initial;
Visual: No Damage
6 Solderability Per SMES-152
Solder coverage:
95% MINIMUM
(per SMES-152)
7
Solder Temperature
Heat Transfer
Resistance
Expose connector terminals tails to wave
solder process.
Dwell time duration: 5 ± 0.5 seconds;
Solder Temperature: 260 ± 5°C
Visual: No Damage to the
insulator where terminal or pin
locks to the connector housing.
) PS-45750-OO1 1 2 3 Reseatina Vibration 65°C @ 50% RH REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. DATE. CONN ECTOR SYSTEM DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 11 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
7.0 TEST SEQUENCES
Environmental test sequences for Groups 1, 2, 3, 5 and 7 performed in accordance with
EIA-364-1000. Sequence for Group 4 per Nortel Optical Networks specification test plan.
Test Group 1
(10) Tin; (10) Gold
Initial Low Level
Contact Resistance
Durability
(preconditioning)
Low Level
Contact Resistance
Temperature Life
105°C for 240 hrs.
Low Level
Contact Resistance
Reseating
Final Low Level
Contact Resistance
Test Group 2
(10) Tin; (10) Gold
Initial Low Level
Contact Resistance
Durability
(preconditioning)
Low Level
Contact Resistance
Thermal Shock
(85°C to -55°C)
Low Level
Contact Resistance
Cyclic Humidity
(25°C @ 80% RH to
65°C @ 50% RH
Low Level
Contact Resistance
Reseating
Final Low Level
Contact Resistance
Test Group 3
(10) Tin; (10) Gold
Initial Low Level
Contact Resistance
Durability
(preconditioning)
Low Level
Contact Resistance
Temperature Life
(preconditioning)
105°C for 120 hrs.
Low Level
Contact Resistance
Vibration
Final Low Level
Contact Resistance
) molex’ C 5 Days REVISION. ECRIECN INFORMATION. TITLE. SHEET No. EC No. % CONNECTOR SYSTEM DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY. PS-45750-OO1
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 12 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
7.0 TEST SEQUENCES (CON’D)
Test Group 4
(10) Gold
Initial Low Level
Contact Resistance
Durability
50 cycles
Temperature Life
(preconditioning)
Low Level
Contact Resistance
Mixed Flowing Gas
5 Days
Low Level
Contact Resistance
Unmate / Mate
1 Cycle
Low Level
Contact Resistance
Mixed Flowing Gas
5 Days
Unmate / Mate
1 Cycle
Mixed Flowing Gas
5 Days
Low Level
Contact Resistance
Unmate / Mate
1 Cycle
Low Level
Contact Resistance
Mixed Flowing Gas
5 Days
Thermal Disturbance
Final Low Level
Contact Resistance
) PS -45750-001 5 Individual Tests Force in Housing 250 cycles gold Insulation Resistance Reseatina Normal Force REVISION. ECRIECN INFORMATION. TITLE. SHEET No. EC No. DATE. CONN ECTOR SYSTEM DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION: ECR/ECN INFORMATION: TITLE: PRODUCT SPECIFICATION FOR
MINI-FIT PLUS HCS
CONNECTOR SYSTEM
SHEET No.
C1 EC No: UCP2011-0141 13 of 13
DATE: 2010 /07/15
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
PS
-
45750
-
001
BWIRKUS BWIRKUS APATEL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
7.0 TEST SEQUENCES (CON’D)
Test Group 7
(10) Tin; (10) Gold
Initial Low Level
Contact Resistance
Dielectric withstanding
voltage
Low Level
Contact Resistance
Durability
100 cycles tin;
250 cycles gold
Final Low Level
Contact Resistance
Dielectric withstanding
voltage
Test Group 5
(10) Tin
Initial Low Level
Contact Resistance
Durability
(preconditioning)
Low Level
Contact Resistance
Temperature Life
(preconditioning)
105°C for 120 hrs.
Low Level
Contact Resistance
Thermal Cycling
15°C to 85°C
Low Level
Contact Resistance
Reseating
Final Low Level
Contact Resistance
Individual Tests
Mating / Unmating
Force (individual ckts.)
Temperature Rise
Crimped Wire
Retention
Insulation Resistance
Crimped Terminal
Insertion / Retention
Force in Housing
PC Tail Retention in
Housing
Thumb Latch
Operation Force
Solder Heat Transfer
Resistance
Thumb Latch Yield
Strength
PCB Peg Engagement
and Separation Forces
Solderability
Normal Force

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