Heat Sinks

Results: 3
Manufacturer
Advanced Thermal Solutions Inc.Wakefield-Vette
Series
-960pushPIN™
Packaging
BoxBulkTray
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)BGA
Attachment Method
Push PinThermal Tape, Adhesive (Included)
Shape
Square, FinsSquare, Pin Fins
Length
0.591" (15.00mm)0.748" (19.00mm)1.181" (30.00mm)
Width
0.591" (15.00mm)0.748" (19.00mm)1.181" (30.00mm)
Fin Height
0.768" (19.50mm)1.102" (28.00mm)1.378" (35.00mm)
Thermal Resistance @ Forced Air Flow
3.98°C/W @ 100 LFM4.00°C/W @ 200 LFM13.40°C/W @ 200 LFM
Material Finish
Black AnodizedBlue Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

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of 3
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
477
In Stock
1 : ₹746.53000
Bulk
-
Bulk
ActiveTop MountBGAThermal Tape, Adhesive (Included)Square, Fins0.591" (15.00mm)0.591" (15.00mm)-0.768" (19.50mm)-13.40°C/W @ 200 LFM-AluminumBlack Anodized
960
960-19-28-F-AB-0
HEATSINK 19X28MM FRONT PUSH PIN
Wakefield-Vette
781
In Stock
1 : ₹470.01000
Box
Box
ActiveTop MountBGAPush PinSquare, Pin Fins0.748" (19.00mm)0.748" (19.00mm)-1.102" (28.00mm)-4.00°C/W @ 200 LFM-AluminumBlack Anodized
0
In Stock
Check Lead Time
1 : ₹326.35000
Tray
Tray
ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Push PinSquare, Fins1.181" (30.00mm)1.181" (30.00mm)-1.378" (35.00mm)-3.98°C/W @ 100 LFM-AluminumBlue Anodized
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Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.