FFE Series (Lead) Datasheet by TDK Corporation

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All specifications are subject to change without notice.
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
FFE series
Piezoelectronic Ceramic Filters
Lead type
10.7MHz
Issue date: August 2007
I 25:03 2,510 3 Dwmensmns m mm (6) Electrical charactensucs UIT DIAGRAM / I (7) Lead length SUREMENT CIRCUIT WA - 1 Q 0 Reference Level shon condition beIween I and 3 wnham DUT. - Au specificafions are sublect :0 change whom no fee
(1/2)
002-01 / 20070815 / ef12_ffe.fm
• All specifications are subject to change without notice.
Ceramic Filters
FFE Series(Lead)
FEATURES
To small dispersion of center frequency in our products, devices
in a single rank can be supplied. Consequently, adjustment-free
IC circuits are easy produced.
Because of the small characteristic dependence on temperature,
IF circuit can be made to have a highly stabilized
temperature(Temperature coefficient of center frequency :
±50ppm/°C).
The size and weight are small and light.
Because of the small loss dispersion as well as the low loss
characteristics, a product of high sensitivity can be
manufactured in the form of set.
Ammo packing is available for various automatic insert machine
(1800pieces/box). Short lead type and L-bend lead type are also
available, please contact TDK.
The products do not contain lead at solder of internal joint and
solder plating of lead wire. You can use both Pb free solder (Sn-
3Ag-0.5Cu) and Sn-Pb eutectic solder on your production.
SHAPES AND DIMENSIONS
CIRCUIT DIAGRAM
MEASUREMENT CIRCUIT
Reference Level: Short condition between 1 and 3 without DUT.
PRODUCT IDENTIFICATIONS
(1) Series name
(2) Center frequency
(3) 3dB band width(BW3)
(4) Center frequency tolerance
(5) Packaging style for product type
(6) Electrical characteristics
(7) Lead length
Conformity to RoHS Directive
4.0max.
Date code
ø0.55±0.1
8.0max.
7.0max.
2.5±0.3 2.5±0.3
5.0+0.5, –1
Color code
107MS
TDK
3
(Out)
2
(GND)
1
(In)
Dimensions in mm
3
2
1
DUT
13
2
R1R2
V
NWA NWA
50
50
R1=R2=280
FFE 1070 MA 11 U X L
(1) (2) (3) (4) (5) (6) (7)
FFE Ceramic filter
1060 10.600MHz
1070 10.700MHz
1080 10.800MHz
MA 280±50kHz
NA 230±50kHz
MS 180±40kHz
MJ 150±40kHz
10 ±20kHz
11 ±30kHz
Symbol
Shapes dimensions
(mm)max. Packaging
style
BW3 symbol
Width Height MA NA MS MJ
U 7.0 7.0 Bulk 33
S 8.0 7.0 Bulk 3
F 8.0 7.0 Bulk 3
H 7.0 7.0 Ammo pack 33
R 8.0 7.0 Ammo pack 3
T 8.0 7.5 Ammo pack 3
Symbol Classification BW3 symbol
MA NA MS MJ
ALow loss
3333
B Standard 33
X Standard 33
Others Custom made
L 5.0+0.5, –1.0mm Taping (Ammo pack)
M 3.0±0.5mm
Others Custom made
Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
onm <2)><2 fe="">
(2/2)
002-01 / 20070815 / ef12_ffe.fm
• All specifications are subject to change without notice.
ELECTRICAL CHARACTERISTICS
Group delay time: 0.50max.
RELIABILITY AND TEST CONDITIONS
The following test items are satisfied.
(1) Center frequency: Within ±30kHz
(2) 3dB band width: Within ±20kHz
(3) 20dB band width: Within ±30kHz
(4) Insertion loss: Within ±2dB
(5) Attenuation: 25dB min.
SOLDERABILITY
The lead wires are adopted Pb free plating wire to apply Pb free
soldering. You can also use current Sn-Pb eutectic solder.
RECOMMENDED SOLDERING CONDITIONS
This is the fit product for flow soldering.
FLOW SOLDERING CONDITION
Part No. 3dB band width
(kHz)
20dB band width
(kHz)max.
Insertion loss
(dB)max.
SPR attenuation
(dB)min.
Standard type
FFE1070MA11UXL 280±50 600 6.0 35
FFE1070NA11UXL 230±50 570 6.0 35
FFE1070MS11SBL 180±40 520 7.0 35
FFE1070MJ11FBL 150±40 400 10.0 35
Low loss type
FFE1070MA11UAL 280±50 600 5.0 35
FFE1070NA11UAL 230±50 570 4.5 35
FFE1070MS11SAL 180±40 520 5.0 35
FFE1070MJ11FAL 150±40 400 7.0 35
Group delay time control type
FFE1070NA10UGL230±50 570 6.0 35
FFE1070MS10SGL180±40 520 7.0 35
Test items Test conditions
Low temperature
storage characteristics
Temperature: –40±3°C
Time: 100h
High temperature
storage characteristics
Temperature: +85±2°C
Time: 100h
Humidity resistance
Loading: DC.5V(between in/out and
ground terminal)
Humidity: 90 to 95(%)RH
Temperature: 60±2°C
Time: 100h
Thermal shock –40°C (30min), 85°C (30min) x 5 cycles
Soldering heat resistance Solder temperature: peak 260°C, 10s flow
Drop Drop 3 times onto a hard wooden board
from a height of 1m
Vibration
Frequency: 10 55 10Hz/Ampli-
tude: 1.5mm
X, Y and Z directions for 2h each
Test conditions Test result
With Rosin-methanol 25% by weight, dip in Sn-Pb
eutectic solder bath at 230±5°C for 3±0.5sec. or
Pb free solder(Sn-3Ag-0.5Cu) bath at 245±2°C
for 3±0.2sec.
95% minimum of
surface should be
covered by new solder.
Heat-resistant temperature 260±5°C
Heat-resistant time 10±1sec.
Number of times 1time

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