MCP1252, 1253 Datasheet by Microchip Technology

‘ Mlcgcmp MCP1252/3
2002-2014 Microchip Technology Inc. DS20001752C-page 1
MCP1252/3
Features:
• Inductorless, Buck/Boost, DC/DC Converter
• Low Power: 80 µA (Typical)
• High Output Voltage Accuracy:
- ±2.5% (VOUT Fixed)
• 120 mA Output Current
• Wide Operating Temperature Range:
- Industrial Temperature (I): -40°C to +85°C
- Extended Temperature (E): -40°C to +125°C
• Thermal Shutdown and Short-Circuit Protection
• Uses Small Ceramic Capacitors
• Switching Frequency:
- MCP1252: 650 kHz
- MCP1253: 1 MHz
• Low-Power Shutdown Mode: 0.1 µA (Typical)
• Shutdown Input Compatible with 1.8V Logic
•V
IN Range: 2.0V to 5.5V
• Selectable Output Voltage (3.3V or 5.0V) or
Adjustable Output Voltage
• Space-Saving, 8-Lead MSOP
• Soft-Start Circuitry to Minimize In-Rush Current
• AEC-Q100 Qualified
Applications:
• White LED Backlighting
• Color Display Bias
• Local 3V-to-5V Conversions
• Flash Memory Supply Voltage
• SIM Interface Supply for GSM Phones
• Smart Card Readers
• PCMCIA Local 5V Supplies
Description:
The MCP1252/3 are inductorless, positive-regulated
charge pump DC/DC converters. The devices generate
a regulated fixed (3.3V or 5.0V) or adjustable output
voltage. They are specifically designed for applications
requiring low noise and high efficiency and are able to
deliver up to 120 mA output current. The devices allow
the input voltage to be lower or higher than the output
voltage, by automatically switching between buck/
boost operation.
The MCP1252 has a switching frequency of 650 kHz,
avoiding interference with sensitive IF bands. The
MCP1253 has a switching frequency of 1 MHz and
allows the use of smaller capacitors than the
MCP1252, thus saving board space and cost.
Both devices feature a power-good output that can be
used to detect out-of-regulation conditions. Extremely
low supply current and low external parts count (three
capacitors) make these devices ideal for small, battery-
powered applications. A shutdown mode is also pro-
vided for further power reduction. The MCP1252 and
MCP1253 feature thermal and short-circuit protection
and are offered in space-saving, 8-lead, MSOP
packages.
Package Types
MSOP (Fixed)
MSOP (Adjustable)
PGOOD
VOUT
VIN
GND
SELECT
SHDN
C+
C-
1
2
3
4
8
7
6
5
PGOOD
VOUT
VIN
GND
FB
SHDN
C+
C-
1
2
3
4
8
7
6
5
MCP1252
MCP1253
MCP1252
MCP1253
Low-Noise, Positive-Regulated Charge Pump
MCP1252/3
DS20001752C-page 2 2002-2014 Microchip Technology Inc.
Functional Block Diagram
PGOOD
200 mV
1.21V
84 mV
+
+
+
Switch
Control
VOUT
VIN
GND
C-
C+
SHDN
SELECT
MCP1252-33X50
173 k
140 k
100 k
+
-
+
-
+
-
PGOOD
200 mV
1.21V
84 mV
+
+
+
Switch
Control
VOUT
VIN
GND
C-
C+
SHDN
FB
MCP1252-ADJ
+
-
+
-
+
-
MCP1253-33X50
MCP1253-ADJ
2002-2014 Microchip Technology Inc. DS20001752C-page 3
MCP1252/3
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Power Supply Voltage, VIN...............................................6.0V
Voltage on Any Pin w.r.t. GND ............... -0.3V to (VIN + 0.3V)
Output Short Circuit Duration ................................continuous
Storage Temperature Range.........................-65°C to +150°C
Ambient Temperature with Power Applied....-55°C to +125°C
Junction Temperature .................................................+150°C
ESD Ratings:
Human Body Model (1.5 k in Series with 100 pF)4kV
Machine Body Model (200 pF, No Series Resistance)400V
†Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are specified for TA = -40°C to +85°C ("I" Temperature), TA = -40°C
to +125°C ("E" Temperature), SHDN = VIN, CIN = COUT = 10 µF, CFLY = 1 µF, IOUT = 10 mA. Typical values are for TA = +25°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Selectable Output - MCP1252-33X50, MCP1253-33X50: SELECT = VIN, VOUT = 3.3V
Supply Voltage VIN 2.1 — 5.5 V
Output Voltage Accuracy VOUT -2.5 ±0.5 +2.5 % 2.3V VIN < 2.5V, IOUT 80 mA
2.5V VIN 5.5V, IOUT120 mA
Output Current IOUT 80 100 — mA 2.3V VIN < 2.5V
120 150 — mA 2.5V VIN 5.5V
SELECT Logic Input Voltage High VIH 1.4 — — V MCP1252-33X50, MCP1253-33X50
Selectable Output - MCP1252-33X50, MCP1253-33X50: SELECT = GND, VOUT = 5.0V
Supply Voltage VIN 2.7 — 5.5 V
Output Voltage Accuracy VOUT -2.5 ±0.5 +2.5 % 2.7V VIN < 3.0V, IOUT 40 mA
3.0V VIN5.5V, IOUT120 mA
Output Current IOUT 40 80 — mA 2.7V VIN < 3.0V
120 150 — 3.0V VIN 5.5V
SELECT Logic Input Voltage Low VIL — — 0.4 V MCP1252-33X50, MCP1253-33X50
Adjustable Output - MCP1252-ADJ, MCP1253-ADJ
Supply Voltage VIN 2.0 — 5.5 V
Output Voltage Adjustment Range VOUT 1.5 — 5.5 V VOUT(MAX) < 2 x VIN
FB Regulation Voltage VFB 1.18 1.21 1.24 V MCP1252-ADJ, MCP1253-ADJ
ALL DEVICES
Supply Current IDD — 60 120 µA No load
Output Short-Circuit Current ISC — 200 — mA VOUT = GND, foldback current
Shutdown Current ISHDN — 0.1 2.0 µA SHDN = 0V
Power Efficiency —81 —%V
IN = 3.0V, VOUT = 5V
IOUT =120 mA
—68 — V
IN = 3.6V, VOUT = 5V
IOUT =120 mA
SHDN Logic Input Voltage Low VIL ——0.4V
SHDN Logic Input Voltage High VIH 1.4 — — V
PGOOD Output Voltage PGOOD_VOL —0.01 — VI
PGOOD = 0.5 mA
PGOOD Threshold Voltage VTH — 0.93VOUT —V
PGOOD Hysteresis VHYS — 0.04VOUT —V
MCP1252/3
DS20001752C-page 4 2002-2014 Microchip Technology Inc.
AC CHARACTERISTICS
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, all limits are specified for TA = -40°C to +85°C ("I" Temperature), TA = -40°C
to +125°C ("E" Temperature), SHDN = VIN, CIN = COUT = 10 µF, CFLY = 1 µF, IOUT = 10 mA. Typical values are for TA = +25°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Internal Oscillator Frequency FOSC 520 650 780 kHz MCP1252
800 1000 1200 MCP1253
Ripple Voltage VRIP —50—mV
p-p MCP1252
—45—mV
p-p MCP1253
VOUT Wake-Up Time From Shutdown TWKUP µsec VIN = 3.6V, IOUT = 10 mA,
SHDN = VIH(MIN),
VOUT from 0 to 90% Nominal
Regulated Output Voltage
— 200 — SELECT = VIN
— 300 — SELECT = GND
Parameters Symbol Min. Typ. Max. Units Conditions
Temperature Ranges:
Specified Temperature Range TA-40 — +85 °C "I" Temperature range
-40 — +125 "E" Temperature range
Maximum Operating Junction
Temperature TJ——+125°C
Storage Temperature Range TA-65 — +150 °C
Thermal Package Resistances:
Thermal Resistance, 8 Pin MSOP JA — 206 — °C/W Single-Layer SEMI G42-88
board, Natural Convection
2002-2014 Microchip Technology Inc. DS20001752C-page 5
MCP1252/3
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, VIN = 3.6V, TA = 25°C, CIN = COUT = 10 µF, CFLY = 1 µF, all capacitors X7R ceramic.
FIGURE 2-1: Output Voltage vs. Supply
Voltage (MCP1252-33X50).
.
FIGURE 2-2: Output Voltage vs. Supply
Voltage (MCP1252-33X50).
FIGURE 2-3: Output Voltage vs. Supply
Voltage (MCP1252-ADJ).
FIGURE 2-4: Percent Efficiency vs.
Supply Voltage (MCP1252-33X50).
FIGURE 2-5: Power Efficiency vs. Supply
Voltage (MCP1252-33X50).
FIGURE 2-6: Power Efficiency vs. Supply
Voltage (MCP1252-ADJ).
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
4.99
5.00
5.01
5.02
5.03
5.04
5.05
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
Output Voltage (V)
10 mA
80 mA 120 mA
MCP1252-33X50
SELECT = GND
VOUT = 5.0V
3.31
3.32
3.33
3.34
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
Output Voltage (V)
10 mA
80 mA
120 mA
MCP1252-33X50
SELECT = VIN
VOUT = 3.3V
2.99
3.00
3.01
3.02
1.52.02.53.03.54.04.55.05.56.0
Supply Voltage (V)
Output Voltage (V)
10 mA
80 mA
120 mA MCP1252-ADJ
VOUT = 3.0V
0
10
20
30
40
50
60
70
80
90
100
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
Percent Efficiency (%)
10 mA 80 mA
120 mA
MCP1252-33X50
SELECT = GND
VOUT = 5.0V
0
10
20
30
40
50
60
70
80
90
100
2.02.53.03.54.04.55.05.56.0
Supply Voltage (V)
Power Efficiency (%)
10 mA 80 mA
120 mA
MCP1252-33X50
SELECT = VIN
VOUT = 3.3V
0
10
20
30
40
50
60
70
80
90
100
1.52.02.53.03.54.04.55.05.56.0
Supply Voltage (V)
Power Efficiency (%)
10 mA
80 mA
120 mA
MCP1252-ADJ
VOUT = 3.0V
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MCP1252/3
DS20001752C-page 6 2002-2014 Microchip Technology Inc.
Note: Unless otherwise indicated, VIN = 3.6V, TA = 25°C, CIN = COUT = 10 mF, CFLY = 1 mF, all capacitors X7R ceramic.
FIGURE 2-7: Output Voltage vs.
Temperature (MCP1252-33X50,
MCP1253-33X50).
FIGURE 2-8: Output Voltage vs.
Temperature (MCP1252-33X50,
MCP1253-33X50).
FIGURE 2-9: Line Transient Response.
FIGURE 2-10: Quiescent Current vs.
Temperature (MCP1253-33X50).
FIGURE 2-11: Quiescent Current vs.
Temperature (MCP1252-33X50).
FIGURE 2-12: Load Transient Response.
4.98
4.99
5.00
5.01
5.02
5.03
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C)
Output Voltage (V)
MCP1252-33X50
MCP1253-33X50
SELECT = GND
VOUT = 5.0V
IOUT = 120 mA
3.28
3.29
3.30
3.31
3.32
3.33
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C)
Output Voltage (V)
MCP1252-33X50
MCP1253-33X50
SELECT = VIN
VOUT = 3.3V
IOUT = 120 mA
40
45
50
55
60
65
70
75
80
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C)
Supply Current (uA)
MCP1253-33X50
SELECT = GND
VOUT = 5.0V, IOUT = 0 mA
VIN = 5.5V
VIN = 3.6V
VIN = 2.7V
VIN = 2.3V
40
45
50
55
60
65
70
75
80
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (°C)
Supply Current (uA)
VIN = 5.5V
VIN = 3.6V
VIN = 2.7V
VIN = 2.3V MCP1252-33X50
SELECT = GND
VOUT = 5.0V, IOUT = 0 mA
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2002-2014 Microchip Technology Inc. DS20001752C-page 7
MCP1252/3
Note: Unless otherwise indicated, VIN = 3.6V, TA = 25°C, CIN = COUT = 10mF, CFLY = 1mF, all capacitors X7R ceramic.
FIGURE 2-13: Output Voltage Ripple vs.
Supply Voltage (MCP1252-33X50).
FIGURE 2-14: Output Voltage Ripple vs.
Supply Voltage (MCP1252-33X50).
FIGURE 2-15: Start-Up (MCP1252-33X50).
FIGURE 2-16: Output Voltage Ripple vs.
Time.
FIGURE 2-17: Output Voltage Ripple vs.
Time.
FIGURE 2-18: Start-Up (MCP1253-33X50).
0
10
20
30
40
50
60
70
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
Output Voltage Ripple (mV)
10 mA
80 mA
120 mA
MCP1252-33X50
SELECT = GND
VOUT = 5.0V
0
10
20
30
40
50
60
70
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
Output Voltage Ripple (mV)
10 mA
80 mA
120 mA
MCP1252-33X50
SELECT = VIN
VOUT = 3.3V
MCP1252/3
DS20001752C-page 8 2002-2014 Microchip Technology Inc.
3.0 PIN FUNCTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Open-Drain Power Good Output
(PGOOD)
PGOOD is a high-impedance when the output voltage
is in regulation. A logic-low is asserted when the output
falls 7% (typical) below the nominal value. The PGOOD
output remains low until VOUT is within 3% (typical) of
its nominal value. On start-up, this pin indicates when
the output voltage reaches its final value. PGOOD is
high-impedance when SHDN is low.
3.2 Regulated Output Voltage (VOUT)
Bypass to GND with a filter capacitor.
3.3 Power Supply Input (VIN)
It is recommended that VIN be tied to a ceramic bypass
capacitor.
3.4 Ground (GND)
It is recommended that the ground pin be tied to a
ground plane for best performance.
3.5 Flying Capacitor Negative
Terminal (C-)
The charge pump capacitor (flying capacitor) is used to
transfer charge from the input supply to the regulated
output.
It is recommended that a low ESR (equivalent series
resistance) capacitor be used.
3.6 Flying Capacitor Positive Terminal
(C+)
The charge pump capacitor (flying capacitor) is used to
transfer charge from the input supply to the regulated
output.
Proper orientation is imperative when using a polarized
capacitor.
3.7 Shutdown Input (SHDN)
A logic-low signal applied to SHDN disables the device.
A logic-high signal applied to this pin allows normal
operation.
3.8 Select (SELECT) Input or
Feedback (FB) Input
MCP1252-33X50, MCP1253-33X50:
SELECT: Select Input Pin.
Connect SELECT to VIN for 3.3V fixed output. Connect
SELECT to GND for a 5.0V fixed output.
MCP1252-ADJ, MCP1253-ADJ:
FB: Feedback Pin.
A resistor divider connected to this pin determines the
adjustable VOUT value (1.5V to 5.5V).
Pin No. Name Function
1 PGOOD Open-Drain Power GOOD Output
2V
OUT Regulated Output Voltage
3V
IN Power Supply Input
4 GND Ground Terminal
5 C- Flying Capacitor Negative Terminal
6 C+ Flying Capacitor Positive Terminal
7 SHDN Shutdown Mode, Active-Low Input
8 SELECT Output Voltage Select Pin (MCP1252-33X50, MCP1253-33X50)
FB Feedback Input Pin for Adjustable Output (MCP1252-ADJ, MCP1253-ADJ)
2002-2014 Microchip Technology Inc. DS20001752C-page 9
MCP1252/3
4.0 DEVICE OVERVIEW
4.1 Theory of Operation
The MCP1252 and MCP1253 family of devices employ
a switched capacitor charge pump to buck or boost an
input supply voltage (VIN) to a regulated output voltage.
Referring to the Functional Block Diagram and
Figure 4-1, the devices perform conversion and
regulation in three phases. When the devices are not in
shutdown mode and a steady-state condition has been
reached, the three phases are continuously cycled
through. The first phase transfers charge from the input
to the flying capacitor (CFLY) connected to pins C+ and
C-. This phase always occurs for half of the internal
oscillator period. During this phase, switches S1 and S2
are closed.
Once the first phase is complete, all switches are
opened and the second phase (idle phase) is entered.
The device compares the internal or external feedback
voltage with an internal reference. If the feedback volt-
age is below the regulation point, the device transitions
to the third phase.
The third phase transfers energy from the flying capac-
itor to the output capacitor connected to VOUT and the
load. If regulation is maintained, the device returns to
the idle phase. If the charge transfer occurs for half the
internal oscillator period, more charge is needed in the
flying capacitor and the device transitions back to the
first phase.
The regulation control is hysteretic, otherwise referred
to as a bang-bang control. The output is regulated
around a fixed reference with some hysteresis. As a
result, typically 50 mV of peak-to-peak ripple will be
observed at the output independent of load current.
The frequency of the output ripple, however, will be
influenced heavily by the load current and output
capacitance. The maximum frequency that will be
observed is equal to the internal oscillator frequency.
The devices automatically transition between buck or
boost operation. This provides a low-cost, compact and
simple solution for step-down/step-up DC/DC
conversion. This is especially true for battery-operated
applications that require a fixed output above or below
the input.
FIGURE 4-1: Flow Algorithm.
START
PHASE 1:
Charge Transfer
From VIN to CFLY
PHASE 2:
Idle State
VFB > VREF
PHASE 3:
Charge Transfer
From CFLY to COUT
No
Yes
No
Yes
Yes
No
No
Yes
VFB > VREF
t11
2FOSC
----------------=
t31
2FOSC
----------------=
{ 5 { 5
MCP1252/3
DS20001752C-page 10 2002-2014 Microchip Technology Inc.
4.2 Power Efficiency
The power efficiency, , is determined by the mode of
operation. In boost mode, the efficiency is
approximately half of a linear regulator. In buck mode,
the efficiency is approximately equal to that of a linear
regulator. The following formulas can be used to
approximate the power efficiency with any significant
amount of output current. At light loads, the quiescent
current of the device must be taken into consideration.
EQUATION 4-1:
4.3 Shutdown Mode
Driving SHDN low places the MCP1252 or MCP1253 in
a low-power shutdown mode. This disables the charge
pump switches, oscillator and control logic, reducing
the quiescent current to 0.1 µA (typical). The PGOOD
output is in a high-impedance state during shutdown.
4.4 PGOOD Output
The PGOOD output is an open-drain output that sinks
current when the regulator output voltage falls below
0.93VOUT (typical). The output voltage can either be
fixed when the selectable output device is chosen
(MCP1252-33X50, MCP1253-33X50) or adjustable
from an external resistive divider when the adjustable
device is chosen (MCP1252-ADJ, MCP1253-ADJ). If
the regulator output voltage falls below 0.93VOUT
(typical) for less than 200 µsec and then recovers,
glitch-immunity circuits prevent the PGOOD signal
from transitioning low. A 10 k to 1 M pull-up resistor
from PGOOD to VOUT may be used to provide a logic
output. Connect PGOOD to GND or leave unconnected
if not used.
4.5 Soft-Start and Short-Circuit
Protection
The MCP1252 and MCP1253 feature foldback short-
circuit protection. This circuitry provides an internal
soft-start function by limiting in-rush current during
startup and also limits the output current to 200 mA
(typical) if the output is shorted to GND. The internal
soft-start circuitry requires approximately 300 µsec,
typical with a 5V output, from either initial power-up or
release from shutdown for the output voltage to be in
regulation.
4.6 Thermal Shutdown
The MCP1252 and MCP1253 feature thermal
shutdown with temperature hysteresis. When the die
temperature exceeds 160°C, typically, the device shuts
down. When the die cools by 15°C, typically, the device
automatically turns back on. If high die temperature is
caused by output overload and the load is not removed,
the device will turn on and off, resulting in a pulse
output.
5.0 APPLICATIONS
The MCP1252 and MCP1253 are inductorless,
positive-regulated, charge pump DC/DC converters. A
typical circuit configuration for the fixed output version
is depicted in Figure 5-1. The adjustable version is
depicted in Figure 5-2.
FIGURE 5-1: Typical Circuit Configuration
for Fixed Output Device.
FIGURE 5-2: Typical Circuit Configuration
for Adjustable Output Device.
BOOST
POUT
PIN
------------- VOUT IOUT
VIN 2
IOUT
------------------------------------ VOUT
VIN 2
------------------== =
BUCK
POUT
PIN
------------- VOUT IOUT
VIN IOUT
-------------------------------- VOUT
VIN
-------------== =
MCP1252-33X50
C+
CFLY
6
5C-
VIN
SHDN
3
7
OFF
ON
Shutdown
Control
+
2.7V to 5.5V
CIN
GND
SELECT
PGOOD
VOUT
8
1
2
+COUT
RPU
PGOOD Flag
To PIC®
+5.0V ±2.5%
SELECTABLE OUTPUT VOLTAGE
4CFLY = 1µF
CIN = 10 µF
COUT = 10 µF
Microcontroller
RPU = 100 k
MCP1252-ADJ
C+
CFLY
6
5C-
VIN
SHDN
3
7
OFF
ON
Shutdown
Control
+
2.7V to 5.5V
CIN
GND
FB
PGOOD
VOUT
8
1
2
+COUT
RPU
PGOOD Flag
To PIC®
+4.0V
ADJUSTABLE OUTPUT VOLTAGE
R2
R1
4
VOUT = 1.21V (1 + R1/R2)
Microcontroller
CFLY = 1µF
CIN = 10 µF
COUT = 10 µF
RPU = 100 k
R1 = 23.2 k
R2 = 10 k
+
2002-2014 Microchip Technology Inc. DS20001752C-page 11
MCP1252/3
5.1 Capacitor Selection
The style and value of capacitors used with the
MCP1252 and MCP1253 family of devices determine
several important parameters such as output voltage
ripple and charge pump strength. To minimize noise
and ripple, it is recommended that low ESR (0.1 )
capacitors be used for both CIN and COUT. These
capacitors should be either ceramic or tantalum and
should be 10 µF or higher. Aluminum capacitors are not
recommended because of their high ESR.
If the source impedance to VIN is very low, up to several
megahertz, CIN may not be required. Alternatively, a
somewhat smaller value of CIN may be substituted for
the recommended 10 µF, but will not be as effective in
preventing ripple on the VIN pin.
The value of COUT controls the amount of output volt-
age ripple present on VOUT. Increasing the size of
COUT will reduce output ripple at the expense of a
slower turn-on time from shutdown and a higher in-rush
current.
The flying capacitor (CFLY) controls the strength of the
charge pump. In order to achieve the maximum rated
output current (120 mA), it is necessary to have at least
1 µF of capacitance for the flying capacitor. A smaller
flying capacitor delivers less charge per clock cycle to
the output capacitor, resulting in lower output ripple.
The output ripple is reduced at the expense of maxi-
mum output current and efficiency.
5.2 Output Voltage Setting
The MCP1252-33X50 and MCP1253-33X50 feedback
controllers select between an internally-set, regulated
output voltage (3.3V or 5.0V). Connect SELECT to
GND for a regulated 5.0V output and connect SELECT
to VIN for a regulated 3.3V output.
The MCP1252-ADJ and MCP1253-ADJ utilize an
external resistor divider that allows the output voltage
to be adjusted between 1.5V and 5.5V. For an adjust-
able output, connect a resistor between VOUT and FB
(R1) and another resistor between FB and GND (R2). In
the following equation, choose R2 to be less than or
equal to 30 k and calculate R1 from the following
formula:
EQUATION 5-1:
and:
EQUATION 5-2:
Note that the tolerance of the external resistors will
have an effect on the accuracy of the output voltage.
For optimum results, it is recommended that the
external resistors have a tolerance no larger than 1%.
5.3 Recommended Layout
The MCP1252 and MCP1253 family of devices transfer
charge at high switching frequencies, producing fast,
high peak, transient currents. As a result, any stray
inductance in the component layout will produce
unwanted noise in the system. Proper board layout
techniques are required to ensure optimum perfor-
mance. Figure 5-3 depicts the recommended board
layout. The input capacitor connected between VIN and
GND, and the output capacitor connected between
VOUT and GND, are 10 µF ceramic, X7R dielectric, in
1206 packages. The flying capacitor connected
between C+ and C- is a 1 µF ceramic, X7R dielectric in
a 0805 package. The layout is scaled 3:1.
FIGURE 5-3: Recommended Printed
Circuit Board Layout.
R1R2VOUT VFB
1–=
VOUT VFB 1R
1R2
+=
where:
VOUT is the desired output voltage from 1.5V to 5.5V
VFB is the internal regulation voltage, nominally 1.21V
PGOOD
VOUT
GND
VIN
C+
C-
SHDN
SELECT
£1 [5;17 HW ”iffy \\ V
MCP1252/3
DS20001752C-page 12 2002-2014 Microchip Technology Inc.
6.0 TYPICAL APPLICATION CIRCUITS
+
-
GND
C+C-
VIN VOUT
SHDN
78
23
MCP1252-33X50
10 µF 10 µF
Single
Li-Ion
Cell
PGOOD 4
SELECT
1
100 k
1µF
56
5V
MCP1252-ADJ
White LED Bias
595959595959
PWM Contrast
Control
Alternative White LED Bias
UP TO 6 WHITE LEDS
24k
10k
Single Cell Lithium-Ion Battery To 5V Converter
+
-
GND
C+C-
VIN VOUT
SHDN
78
23
10 µF 10 µF
Single
Li-Ion
Cell
PGOOD 4
SELECT
1
100 k
1µF
56
MCP1252-ADJ
10 10 10 10 10 10
PWM Contrast
Control
UP TO 6 WHITE LEDS
+
-
GND
C+C-
VIN VOUT
SHDN
78
23
10 µF 10 µF
Single
Li-Ion
Cell
PGOOD 4
SELECT
1
100 k
1µF
56
HHHH HT’H WWNNN 06> XXXXXX ’HT’ XXXXXX YWWNNN 06>
2002-2014 Microchip Technology Inc. DS20001752C-page 13
MCP1252/3
7.0 PACKAGING INFORMATION
7.1 Package Marking
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
8-Lead MSOP (Fixed) Example:
1252SX
412256
8-Lead MSOP (Adjustable) Example:
OR
1253DJ
412256
1253EX
412256
8-Lead Plastic Micro Small Outline Package (MS) [MSOP] 'F‘ M |—l goon NX b .---a TOP VIEW Q 010 C _ SEATING PLANE _T—l J SIDE VIEW A1 * j/ SEE DETAlLC _ “—E _ _J END VIEW Microchlp Technology Drawmg C047111C Sheet 1 cl 2
MCP1252/3
DS20001752C-page 14 2002-2014 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
B-Lead Plastic Micro Small Outline Package (MS) [MSOP] _ _GAUGE PLANE c SEATING PLANE —\f_—7 L ‘P (U) DETAIL c Unlts MILLlMETERS Dlmension mm mm NOM MAX Number ol Plns N | a \ Pilcn e 0.55 asc Overall Heighl A . . 1 lo Molded Package Thickness A2 0 75 0 85 0 95 Standoff Al 0 no . 0 15 Overall Wldth E 4 90 BSC Molded Package Wldm E1 3 DU 580 Overall Lenglh D 3 00 880 Foot Length L o 40 | 0 60 l 0 so Foalpnnl L1 0 95 REF Foot Angle W 0” - a" Lead Thickness c 0 08 , 0 23 Lead Wldlh b o 22 , 0 4o Notes: 1 Pin 1 visual index lealure may vary‘ but mus| be localed Wlmm lne hatched area 2 Dimenslons D and El do nol include mold llasn or protrusions. Mold flash or protrusions shall not exceed 0.15m!“ per side 3 Dlmenslanlng and lolerancmg per ASME v14 5M asc. aaslc Dlmension. Thearellcally and value shown wimoul tolerances. REF: Relerence Dlmenslon‘ usually without tolerance, lor inlonnalion purposes only. Mlcrocl'llp Technology Drawlng 004711“: Sheet 2 an
2002-2014 Microchip Technology Inc. DS20001752C-page 15
MCP1252/3
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
S-Lead Plastic Micro Smali Outline Package (MS) [MSOP] ’* ” ' \ SILK _—. SCREEN I i —><—gx eiel="" recommended="" land="" pattern="" units="" millimeters="" dimension="" limits="" min="" i="" nom="" i="" max="" contact="" pitch="" e="" 0.65="" bsc="" contact="" pad="" spacing="" c="" 4.40="" overali="" width="" 2="" 5.35="" contact="" pad="" width="" (x8)="" x1="" 0.45="" contact="" pad="" length="" (xs)="" y1="" 1.45="" distance="" between="" pads="" (31="" 2.95="" distance="" between="" pads="" gx="" 0.20="" notes="" 1="" dimensiomng="" and="" toierancing="" perasme="" y1a="" sm="" 550="" basic="" dimensiun="" theoreticaiiy="" exact="" vaiue="" shown="" wilhuut="" tolerances="" microchip="" technoiogy="" drawing="" no="" c0472111a="">
MCP1252/3
DS20001752C-page 16 2002-2014 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2014 Microchip Technology Inc. DS20001752C-page 17
MCP1252/3
APPENDIX A: REVISION HISTORY
Revision C (July 2014)
The following is the list of modifications:
1. Added the Extended Temperature (E) option
and related information throughout the
document.
Revision B (January 2013)
The following is the list of modifications:
1. Added a note to each package outline drawing.
PART NO. L)? -XX)( /XX _'_
MCP1252/3
DS20001752C-page 18 2002-2014 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX
PackageTemperature
Range
Device
MCP1252: Low-Noise, Positive-Regulated Charge Pump
MCP1252T: Low-Noise, Positive-Regulated Charge Pump
(Tape and Reel)
MCP1253: Low-Noise, Positive-Regulated Charge Pump
MCP1253T: Low-Noise, Positive-Regulated Charge Pump
(Tape and Reel)
Tape and Reel Option: T = Tape and Reel(1)
Output Voltage: ADJ = Adjustable Voltage
33X50 = Selectable Voltage
Temperature Range: I= -40C to +85C (Industrial)
E= -40C to +125C (Extended) (MCP1253 only)
Package: MS = Plastic Micro Small Outline (MSOP), 8-lead
Examples:
a) MCP1252-33X50I/MS: Low-Noise, Posi-
tive-Regulated Charge Pump, Fixed Output
b) MCP1252-ADJI/MS: Low-Noise, Positive-
Regulated Charge Pump, Adjustable Output
c) MCP1252T-33X50I/MS: Tape and Reel,
Low-Noise, Positive-Regulated Charge
Pump, Fixed Output
a) MCP1253-33X50I/MS: Low-Noise, Posi-
tive-Regulated Charge Pump, Fixed Output
b) MCP1253-ADJI/MS: Low-Noise, Posi-
tive-Regulated Charge Pump, Adjustable
Output
c) MCP1253T-ADJI/MS: Tape and Reel,
Low-Noise, Positive-Regulated Charge
Pump, Adjustable Output
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
[X](1)
Tape and Reel
Option
-XXX
Voltage
Option
YSTEM
2002-2014 Microchip Technology Inc. DS20001752C-page 19
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-373-0
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘ ‘MICRDCHIP
DS20001752C-page 20 2002-2014 Microchip Technology Inc.
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