BOYD

Ultrastick Thermal Interface

Boyd’s ultrastick improves heat transfer and provides a simple application to both heat sink and component surfaces

Ultrastick Thermal Interface Boyd's ultrastick is a unique thermal interface material (TIM) that allows for phase change or flow when temperatures increase to enable a more uniform coating than typical TIMs. Ultrastick improves heat transfer as well as providing simple, quick application to both heat sink and component surfaces due to its convenient application bar, thus ensuring that assembly time is much shorter. The quick, cost-effective use provides exceptional heat transfer and low interface resistance. Ultrastick is a solid silicone-free, paraffin-based thermal compound that changes phase at 60°C.

Features
  • Easy to apply stick application
  • Quick assembly time
  • Phase change
Applications
  • Anything requiring a heat sink
Published: 2014-12-09

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