Amphenol SV Microwave

3 mm Board-to-Board Interconnects

Amphenol SV Microwave's 3 mm product line is ideal for high-density stacked and high-density multiport applications

Image of Amphenol SV Microwave's 3 MM Board-to-Board InterconnectsAmphenol SV Microwave's line of 3 mm coaxial between board spacing PCB interconnects allows for the lowest stacked height (3 mm) of any board-to-board high frequency coaxial connection system currently available. It is ideal for high-density stacked and high-density multiport applications. Additionally, installation of this line includes options with and without solder.

Features
  • 3 mm board-to-board spacing
  • 0.150" minimum pitch between adjacent connectors
  • DC to 40 GHz
  • Low-force, solderless installation does not damage PCB
  • High-density stacked PCB applications
  • Easy to assemble, solderless design reduces yield and assembly time
  • Lowest stacked height (3 mm) of any board-to-board high frequency coaxial connection system currently available
  • Embedded computing applications
Applications
  • Embedded computing
  • High-density stacked PCB applications
  • High-density multiport applications
Published: 2018-05-10

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