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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Manufacturer | 3M | |
Series | ||
Packaging | Bulk | |
Part Status | Obsolete | |
Type | PGA, ZIF (ZIP) | |
Number of Positions or Pins (Grid) | 441 (21 x 21) | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 30.0µin (0.76µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | - | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30.0µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polyethersulfone (PES) | |
Operating Temperature | -55°C ~ 150°C | |
Termination Post Length | 0.130" (3.30mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating (Amps) | 1 A | |
Contact Resistance | - | |
Base Product Number |
Obsolete
Associated Product
1 Items
India