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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Product Attributes
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Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
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In-Stock: 2,453
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Quantity
All prices are in INR
Box
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | ₹250.45000 | ₹250.45 |
| 10 | ₹221.43700 | ₹2,214.37 |
| 25 | ₹210.90840 | ₹5,272.71 |
| 50 | ₹203.31000 | ₹10,165.50 |
| 100 | ₹195.96650 | ₹19,596.65 |
| 250 | ₹186.64968 | ₹46,662.42 |
| 756 | ₹175.98112 | ₹1,33,041.73 |
| 1,512 | ₹169.60169 | ₹2,56,437.76 |
| 5,292 | ₹158.63518 | ₹8,39,497.37 |
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