Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)
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TS391LT50

DigiKey Part Number
TS391LT50-ND
Manufacturer
Manufacturer Product Number
TS391LT50
Description
THERMALLY STABLE SOLDER PASTE NO
Manufacturer Standard Lead Time
3 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)
Datasheet
 Datasheet
Product Attributes
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Category
Mesh Type
4
Manufacturer
Chip Quik Inc.
Process
Lead Free
Packaging
Bulk
Form
Jar, 1.76 oz (50g)
Part Status
Active
Shelf Life
12 Months
Type
Solder Paste
Shelf Life Start
Date of Manufacture
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Storage/Refrigeration Temperature
68°F ~ 77°F (20°C ~ 25°C)
Melting Point
281°F (138°C)
Base Product Number
Flux Type
No-Clean
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
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All prices are in INR
Bulk
QuantityUnit PriceExt Price
1₹2,045.43000₹2,045.43
Manufacturers Standard Package