No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
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TS991SNL35T4

DigiKey Part Number
315-TS991SNL35T4-ND
Manufacturer
Manufacturer Product Number
TS991SNL35T4
Description
THERMALLY STABLE SOLDER PASTE NC
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
-
Form
Syringe, 1.23 oz (34.869g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Shipping Info
-
Weight
-
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In-Stock: 5
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All prices are in INR
Bulk
QuantityUnit PriceExt Price
1₹3,973.45000₹3,973.45
5₹3,424.21200₹17,121.06
10₹3,211.56200₹32,115.62
25₹2,950.19440₹73,754.86
50₹2,766.28240₹1,38,314.12
100₹2,593.39430₹2,59,339.43
Manufacturers Standard Package