MBA33002-21P/CU/3.4Y
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

MBA33002-21P/CU/3.4Y

DigiKey Part Number
4573-MBA33002-21P/CU/3.4Y-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
MBA33002-21P/CU/3.4Y
Description
CU HEAT SINK 33X33X21MM WITH PIN
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Copper Top Mount
Product Attributes
Type
Description
Select All
Category
Mfr
Malico Inc.
Series
MBA
Packaging
Tray
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Pin Fins
Length
1.299" (33.00mm)
Width
1.299" (33.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 54
Check for Additional Incoming Stock
Quantity
All prices are in INR
Tray
QuantityUnit PriceExt Price
1₹501.91000₹501.91
10₹443.83900₹4,438.39
25₹422.80680₹10,570.17
50₹407.52840₹20,376.42
100₹392.79860₹39,279.86
250₹374.11384₹93,528.46
450₹362.58382₹1,63,162.72
950₹348.42963₹3,31,008.15
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
Associated Product
1 Items
EP4CE6E22C8N

EP4CE6E22C8N

IC FPGA 91 I/O 144EQFP

Altera

₹1,493.33000
You May Also Be Interested InSee All
3 Items
MBH14002-09P/CU/2

MBH14002-09P/CU/2

CU HEAT SINK 14X14X9MM WITH PIN

Malico Inc.

₹452.34000
HSB20-353525

HSB20-353525

HEAT SINK, BGA, 35 X 35 X 25 MM

Same Sky (Formerly CUI Devices)

₹189.43000
MBA35002-20P/CU/2.6BU

MBA35002-20P/CU/2.6BU

CU HEAT SINK 35X35X20MM WITH PIN

Malico Inc.

₹501.91000