InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A.
Tel: +1 (408) 988-7339
Fax: +1 (408) 988-8104
Website: w w w .invensense.com
Document Number: PS- MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
MPU-9250
Product Specification
Revision 1.0
MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
CONTENTS
1
DOCUMENT INFORMATION
............................................................................................................
4
1.1
R
EVISION
H
ISTORY
....................................................................................................................
4
1.2
P
URPOSE AND
S
COPE
................................................................................................................
5
1.3
P
RODUCT
O
VERVIEW
.................................................................................................................
5
1.4
A
PPL ICATIONS
..........................................................................................................................
5
2
FEATURES
......................................................................................................................................
6
2.1
G
YROSCOPE
F
EA TURES
.............................................................................................................
6
2.2
A
CCELEROMETER
F
EA TURES
......................................................................................................
6
2.3
M
AGNETOMETER
F
EA TURES
.......................................................................................................
6
2.4
A
DDITIONAL
F
EA TURES
..............................................................................................................
6
2.5
M
OTION
P
ROCESSING
.................................................................................................................
7
3
ELECTRICAL CHARACTERISTICS
..................................................................................................
8
3.1
G
YROSCOPE
S
PECIFICATIONS
.....................................................................................................
8
3.2
A
CCEL EROMETER
S
PECIFICATIONS
..............................................................................................
9
3.3
M
AGNETOMETER
S
PECIFICATIONS
.............................................................................................
10
3.4
E
LECTRICAL
S
PECIFICATIONS
....................................................................................................
11
3.5
I2C
T
IMING
C
HARACTERIZATION
................................................................................................
15
3.6
SPI
T
IMING
C
HARACTERIZATION
................................................................................................
16
3.7
A
BSOLUTE
M
A XIMUM
R
ATINGS
..................................................................................................
18
4
APPLICATIONS INFORMATION
.....................................................................................................
19
4.1
P
IN
O
UT AND
S
IGNAL
D
ES CRIPTION
............................................................................................
19
4.2
T
YPICAL
O
PERATING
C
IRCUIT
....................................................................................................
20
4.3
B
ILL OF
M
ATERIALS FOR
E
XTERNAL
C
OMPONENTS
.......................................................................
20
4.4
B
LOCK
D
IAGRAM
.....................................................................................................................
21
4.5
O
VERVIEW
.............................................................................................................................
22
4.6
T
HREE
-A
XIS
MEMS
G
YROSCOPE WITH
16-
BIT
ADC
S AND
S
IGNAL
C
ONDITIONING
.............................
22
4.7
T
HREE
-A
XIS
MEMS
A
CCEL EROMETER W ITH
16-
BIT
ADC
S AND
S
IGNAL
C
ONDITIONING
......................
22
4.8
T
HREE
-A
XIS
MEMS
M
AGNETOMETER WITH
16-
BIT
ADC
S AND
S
IGNAL
C
ONDITIONING
.......................
22
4.9
D
IGITAL
M
OTION
P
ROCESS OR
...................................................................................................
22
4.10
P
RIMARY
I2C
AND
SPI
S
ERIAL
C
OMMUNICATIONS
I
NTERFACES
......................................................
23
4.11
A
UXILIARY
I2C
S
ERIAL
I
NTERFACE
.............................................................................................
23
4.12
S
ELF
-T
ES T
.............................................................................................................................
24
4.13
MPU-9250
S
OL UTION
U
SING
I2C
I
NTERFACE
..............................................................................
25
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
4.14
MPU-9250
S
OL UTION
U
SING
SPI
I
NTERFACE
..............................................................................
26
4.15
C
LOCKING
..............................................................................................................................
26
4.16
S
ENSOR
D
ATA
R
EGIS TERS
.......................................................................................................
27
4.17
FIFO
.....................................................................................................................................
27
4.18
I
NTERRUPTS
...........................................................................................................................
27
4.19
D
IGITAL
-O
UTPUT
T
EMPERATURE
S
ENSOR
...................................................................................
27
4.20
B
IAS AND
LDO
........................................................................................................................
28
4.21
C
HARGE
P
UMP
.......................................................................................................................
28
4.22
S
TANDARD
P
OWER
M
ODE
........................................................................................................
28
4.23
P
OWER
S
EQUENCING
R
EQUIREMENTS AND
P
OWER ON
R
ES ET
.......................................................
28
5
ADVANCED HARDWARE FEATURES
............................................................................................
29
6
PROGRAMMABLE INTERRUPTS
...................................................................................................
30
6.1
W
AKE
-
ON
-M
OTION
I
NTERRUPT
..................................................................................................
30
7
DIGITAL INTERFACE
.....................................................................................................................
32
7.1
I2C
AND
SPI
S
ERIA L
I
NTERFACES
..............................................................................................
32
7.2
I2C
I
NTERFACE
.......................................................................................................................
32
7.3
I2C
C
OMMUNICATIONS
P
ROTOCOL
.............................................................................................
32
7.4
I2C
T
ERMS
............................................................................................................................
35
7.5
SPI
I
NTERFACE
.......................................................................................................................
36
8
SERIAL INTERFACE CONSIDERATIONS
.......................................................................................
37
8.1
MPU-9250
S
UPPORTED
I
NTERFACES
.........................................................................................
37
9
ASSEMBLY
....................................................................................................................................
38
9.1
O
RIENTATION OF
A
X ES
.............................................................................................................
38
9.2
P
ACKAGE
D
IMENSIONS
.............................................................................................................
38
10
PART NUMBER PACKAGE MARKING
...........................................................................................
40
11
RELIABILITY
..................................................................................................................................
41
11.1
Q
UALIFICATION
T
ES T
P
OL ICY
....................................................................................................
41
11.2
Q
UALIFICATION
T
ES T
P
LAN
.......................................................................................................
41
12
REFERENCE
..................................................................................................................................
42
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
1 Document Information
1.1
Revision History
Revision
Date
Revision
Description
01/17/14
1.0
Initial Release
Page
4
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
1.2
Purpose and Scope
This document is a preliminary product specification, providing a description, specifications, and design
related information on the MPU-9250™ MotionTracking device. The device is housed in a small 3x3x1mm
QFN package.
Specifications are subject to change without notice. Final specifications will be updated based upon
characterization of production silicon. For references to register map and descriptions of individual registers,
please refer to the MPU-9250 Register Map and Register Descriptions document.
1.3
Product Overview
MPU-9250 is a multi-chip module (MCM) consisting of two dies integrated into a single QFN package. One
die houses the 3-Axis gyroscope and the 3-Axis accelerometer. The other die houses the AK8963 3-Axis
magnetometer from Asahi Kasei Microdevices Corporation.
Hence, the MPU-9250 is
a
9-axis
MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, 3-axis magnetometer and a
Digital Motion Processor™ (DMP) all in a small 3x3x1mm package available as a pin-compatible upgrade
from the MPU-6515.
With its dedicated I
2
C sensor bus, the MPU-9250 directly provides complete 9-axis
MotionFusion™ output. The MPU-9250 MotionTracking device, with its 9-axis integration, on-chip
MotionFusion™, and run-time calibration firmware, enables manufacturers to eliminate the costly and
complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal
motion performance for consumers.
MPU-9250 is also designed to interface with multiple non-inertial digital
sensors, such as pressure sensors, on its auxiliary I
2
C port.
MPU-9250 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs,
three 16-bit ADCs for digitizing the accelerometer outputs, and three 16-bit ADCs for digitizing the
magnetometer outputs.
For precision tracking of both fast and slow motions, the parts feature a user-
programmable
gyroscope full-scale range of ±250, ±500, ±1000, and ±2000°/sec (dps), a user-
programmable accelerometer full-scale range of ±2
g
, ±4
g
, ±8
g
, and ±16
g
, and a magnetometer full-scale
range of ±4800μT.
Other industry-leading features include programmable digital filters, a precision clock with 1% drift from -
40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The device features I
2
C and
SPI serial interfaces, a VDD operating range of 2.4V to 3.6V, and a separate digital IO supply, VDDIO from
1.71V to VDD.
Communication with all registers of the device is performed using either I
2
C at 400kHz or SPI at 1MHz. For
applications requiring faster communications, the sensor and interrupt registers may be read using SPI at
20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package
size down to a footprint and thickness of 3x3x1mm, to provide a very small yet high performance low cost
package. The device provides high robustness by supporting 10,000
g
shock reliability.
1.4
Applications
•
TouchAnywhere
™ technology (for "no touch" UI Application Control/Navigation)
•
MotionCommand
™ technology (for Gesture Short-cuts)
•
Motion-enabled game and application framework
•
Location based services, points of interest, and dead reckoning
•
Handset and portable gaming
•
Motion-based game controllers
•
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
•
Wearable sensors for health, fitness and sports
Page
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
2 Features
2.1
Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-9250 includes a wide range of features:
•
Digital-output X-, Y-, and Z-Axis angular rate sensors (gyroscopes) with a user-programmable full-
scale range of ±250, ±500, ±1000, and ±2000°/sec and integrated 16-bit ADCs
•
Digitally-programmable low-pass filter
•
Gyroscope operating current: 3.2mA
•
Sleep mode current: 8μA
•
Factory calibrated sensitivity scale factor
•
Self-test
2.2
Accelerometer Features
The triple-axis MEMS accelerometer in MPU-9250 includes a wide range of features:
•
Digital-output triple-axis accelerometer with a programmable full scale range of ±2
g
, ±4
g
, ±8
g
and
±16
g
and integrated 16-bit ADCs
•
Accelerometer normal operating current: 450μA
•
Low power accelerometer mode current: 8.4μA at 0.98Hz, 19.8μA at 31.25Hz
•
Sleep mode current: 8μA
•
User-programmable interrupts
•
Wake-on-motion interrupt for low power operation of applications processor
•
Self-test
2.3
Magnetometer Features
The triple-axis MEMS magnetometer in MPU-9250 includes a wide range of features:
•
3-axis silicon monolithic Hall-effect magnetic sensor with magnetic concentrator
•
Wide dynamic measurement range and high resolution with lower current consumption.
•
Output data resolution of 14 bit (0.6μT/LSB) or 16 bit (15μT/LSB)
•
Full scale measurement range is ±4800μT
•
Magnetometer normal operating current: 280μA at 8Hz repetition rate
•
Self-test function with internal magnetic source to confirm magnetic sensor operation on end
products
2.4
Additional Features
The MPU-9250 includes the following additional features:
•
Auxiliary master I
2
C bus for reading data from external sensors (e.g. pressure sensor)
•
3.5mA operating current when all 9 motion sensing axes and the DMP are enabled
•
VDD supply voltage range of 2.4 – 3.6V
•
VDDIO reference voltage for auxiliary I
2
C devices
•
Smallest and thinnest QFN package for portable devices: 3x3x1mm
•
Minimal cross-axis sensitivity between the accelerometer, gyroscope and magnetometer axes
•
512 byte FIFO buffer enables the applications processor to read the data in bursts
•
Digital-output temperature sensor
•
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
•
10,000
g
shock tolerant
•
400kHz Fast Mode I
2
C for communicating with all registers
•
1MHz SPI serial interface for communicating with all registers
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
•
20MHz SPI serial interface for reading sensor and interrupt registers
•
MEMS structure hermetically sealed and bonded at wafer level
•
RoHS and Green compliant
2.5
MotionProcessing
•
Internal Digital Motion Processing™ (DMP™) engine supports advanced MotionProcessing and low
power functions such as gesture recognition using programmable interrupts
•
Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the
step count.
Page
7
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42
MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
3 Electrical Characteristics
3.1
Gyroscope Specifications
Typical Operating Circuit of section
4.2
, VDD = 2.5V, VDDIO = 2.5V, T
A
=25°C, unless otherwise noted.
PARAM ETER
CONDITIONS
MIN
TYP
MAX
UNITS
Full-Scale Range
FS_SEL=0
±250
°/s
FS_SEL=1
±500
°/s
FS_SEL=2
±1000
°/s
FS_SEL=3
±2000
°/s
Gyroscope ADC Word Length
16
bits
Sensitivity Scale Factor
FS_SEL=0
131
LSB/(°/s)
FS_SEL=1
65.5
LSB/(°/s)
FS_SEL=2
32.8
LSB/(°/s)
FS_SEL=3
16.4
LSB/(°/s)
Sensitivity Scale Factor Tolerance
25°C
±3
%
Sensitivity Scale Factor Variation Over
Temperature
-40°C to +85°C
±4
%
Nonlinearity
Best fit straight line; 25°C
±0.1
%
Cross-Axis Sensitivity
±2
%
Initial ZRO Tolerance
25°C
±5
°/s
ZRO Variation Over Temperature
-40°C to +85°C
±30
°/s
Total RMS Noise
DLPFCFG=2 (92 Hz)
0.1
°/s-rms
Rate Noise Spectral Density
0.01
°/s/√Hz
Gyroscope Mechanical Frequencies
25
27
29
KHz
Low Pass Filter Response
Programmable Range
5
250
Hz
Gyroscope Startup Time
From Sleep mode
35
ms
Output Data Rate
Programmable, Normal mode
4
8000
Hz
Table 1 Gyroscope Specifications
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
3.2
Accelerometer Specifications
Typical Operating Circuit of section
4.2
, VDD = 2.5V, VDDIO = 2.5V, T
A
=25°C, unless otherwise noted.
PARAM ETER
CONDITIONS
MIN
TYP
MAX
UNITS
Full-Scale Range
AFS_SEL=0
±2
g
AFS_SEL=1
±4
g
AFS_SEL=2
±8
g
AFS_SEL=3
±16
g
ADC Word Length
Output in tw o's complement format
16
bits
Sensitivity Scale Factor
AFS_SEL=0
16,384
LSB/
g
AFS_SEL=1
8,192
LSB/
g
AFS_SEL=2
4,096
LSB/
g
AFS_SEL=3
2,048
LSB/
g
Initial Tolerance
Component-Level
±3
%
Sensitivity Change vs. Temperature
-40°C to +85°C AFS_SEL=0
Component-level
±0.026
%/°C
Nonlinearity
Best Fit Straight Line
±0.5
%
Cross-Axis Sensitivity
±2
%
Zero-G Initial Calibration Tolerance
Component-level, X,Y
±60
m
g
Component-level, Z
±80
m
g
Zero-G Level Change vs. Temperature
-40°C to +85°C
±1.5
m
g
/°C
Noise Pow er Spectral Density
Low noise mode
300
μ
g
/√ Hz
Total RMS Noise
DLPFCFG=2 (94Hz)
8
mg-rms
Low Pass Filter Response
Programmable Range
5
260
Hz
Intelligence Function Increment
4
m
g
/LSB
Accelerometer Startup Time
From Sleep mode
20
ms
From Cold Start, 1ms V
DD
ramp
30
ms
Output Data Rate
Low power (duty-cycled)
0.24
500
Hz
Duty-cycled, over temp
±15
%
Low noise (active)
4
4000
Hz
Table 2 Accelerometer Specifications
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
3.3
Magnetometer Specifications
Typical Operating Circuit of section
4.2
, VDD = 2.5V, VDDIO = 2.5V, T
A
=25°C, unless otherwise noted.
PARAM ETER
CONDITIONS
MIN
TYP
MAX
UNITS
M AGNETOM ETER SENSITIV ITY
Full-Scale Range
±4800
μT
ADC Word Length
14
bits
Sensitivity Scale Factor
0.6
μT / LSB
ZERO-FIELD OUTPUT
Initial Calibration Tolerance
±500
LSB
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
3.4
Electrical Specifications
3.4.1
D.C. Electrical Characteristics
Typical Operating Circuit of section
4.2
, VDD = 2.5V, VDDIO = 2.5V, T
A
=25°C, unless otherwise noted.
PARAM ETER
CONDITIONS
MIN
TYP
MAX
Units
Note s
SUPPLY VOLTAGES
VDD
2.4
2.5
3.6
V
VDDIO
1.71
1.8
VDD
V
SUPPLY CURRENTS
Normal Mode
9-axis (no DMP), 1 kHz gyro ODR, 4 kHz
accel ODR, 8 Hz mag. repetition rate
3.7
mA
6-axis (accel + gyro, no DMP), 1 kHz gyro
ODR, 4 kHz accel ODR
3.4
mA
3-axis Gyroscope only (no DMP), 1 kHz ODR
3.2
mA
6-axis (accel + magnetometer, no DMP), 4
kHz accel ODR, mag. repetition rate = 8 Hz
730
μA
3-Axis Accelerometer, 4kHz ODR (no DMP)
450
μA
3-axis Magnetometer only (no DMP), 8 Hz
repetition rate
280
μA
Accelerometer Low Pow er Mode
(DMP, Gyroscope, Magnetometer
disabled)
0.98 Hz update rate
8.4
μA
1
31.25 Hz update rate
19.8
μA
1
Full Chip Idle Mode Supply Current
8
μA
TEMPERATURE RANGE
Specified Temperature Range
Performance parameters are not applicable
beyond Specified Temperature Range
-40
+85
°C
Table 3 D.C. Electrical Characteristics
Notes:
1.
Accelerometer Low Power Mode supports the following output data rates (ODRs): 0.24, 0.49, 0.98,
1.95, 3.91, 7.81, 15.63, 31.25, 62.50, 125, 250, 500Hz. Supply current for any update rate can be
calculated as:
Supply Current in μA = Sleep Current + Update Rate * 0.376
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
3.4.2
A.C. Electrical Characteristics
Typical Operating Circuit of section
4.2
, VDD = 2.5V, VDDIO = 2.5V, T
A
=25°C, unless otherwise noted.
Parameter
Conditions
MIN
TYP
MA X
Units
Supply Ramp Time
Monotonic ramp. Ramp rate
is 10% to 90% of the final
value
0.1
100
ms
Operating Range
Ambient
-40
85
°C
Sensitivity
Untrimmed
333.87
LSB/°C
Room Temp Offset
21°C
0
LSB
Supply Ramp Time (T
RA MP
)
Valid pow er-on RESET
0.01
20
100
ms
Start-up time for register read/write
From pow er-up
11
100
ms
I
2
C ADDRESS
AD0 = 0
AD0 = 1
1101000
1101001
V
IH
, High Level Input Voltage
0.7*VDDIO
V
V
IL
, Low Level Input Voltage
0.3*VDDIO
V
C
I
, Input Capacitance
< 10
pF
V
OH
, High Level Output Voltage
R
LOAD
=1MΩ
;
0.9*VDDIO
V
V
OL1
, LOW-Level Output Voltage
R
LOAD
=1MΩ
;
0.1*VDDIO
V
V
OL.INT1
, INT Low -Level Output Voltage
OPEN=1, 0.3mA sink
Current
0.1
V
Output Leakage Current
OPEN=1
100
nA
t
INT
, INT Pulse Width
LATCH_INT_EN=0
50
μs
V
IL
, LOW Level Input Voltage
-0.5V
0.3*VDDIO
V
V
IH
, HIGH-Level Input Voltage
0.7*VDDIO
VDDIO +
0.5V
V
V
hys
, Hysteresis
0.1*VDDIO
V
V
OL
, LOW-Level Output Volt age
3mA sink current
0
0.4
V
I
OL
, LOW-Level Output Current
V
OL
=0.4V
V
OL
=0.6V
3
6
mA
mA
Output Leakage Current
100
nA
t
of
, Output Fall Time from V
IHmax
to V
ILmax
C
b
bus capacitance in pf
20+0.1C
b
250
ns
V
IL
, LOW-Level Input Voltage
-0.5V
0.3*VDDIO
V
V
IH
, HIGH-Level Input Voltage
0.7* VDDIO
VDDIO +
0.5V
V
V
hys
, Hysteresis
0.1* VDDIO
V
V
OL1
, LOW-Level Output Voltage
VDDIO > 2V; 1mA sink
current
0
0.4
V
V
OL3
, LOW-Level Output Voltage
VDDIO < 2V; 1mA sink
current
0
0.2* VDDIO
V
I
OL
, LOW-Level Output Current
V
OL
=
0.4V
V
OL
= 0.6V
3
6
mA
mA
Output Leakage Current
100
nA
t
of
, Output Fall Time from V
IHmax
to V
ILmax
C
b
bus capacitance in pF
20+0.1C
b
250
ns
Sample Rate
Fchoice=0,1,2
SMPLRT_DIV=0
32
kHz
Fchoice=3;
DLPFCFG=0 or 7
SMPLRT_DIV=0
8
kHz
Fchoice=3;
DLPFCFG=1,2,3,4,5,6;
SMPLRT_DIV=0
1
kHz
Clock Frequency Initial Tolerance
CLK_SEL=0, 6; 25°C
-2
+2
%
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
CLK_SEL=1,2,3,4,5; 25°C
-1
+1
%
Frequency Variation over Temperature
CLK_SEL=0,6
-10
+10
%
CLK_SEL=1,2,3,4,5
±1
%
Table 4 A.C. Electrical Characteristics
Page
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
3.4.3
Other Electrical Specifications
Typical Operating Circuit of section
4.2
, VDD = 2.5V, VDDIO = 2.5V, T
A
=25°C, unless otherwise noted.
PARAM ETER
CONDITIONS
MIN
TYP
MAX
Units
SPI Operating Frequency, All
Registers Read/Write
Low Speed Characterization
100
±10%
kHz
High Speed Characterization
1 ±10%
MHz
SPI Operating Frequency, Sensor
and Interrupt Registers Read Only
20 ±10%
MHz
I
2
C Operating Frequency
All registers, Fast-mode
400
kHz
All registers, Standard-mode
100
kHz
Table 5 Other Electrical Specifications
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Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
3.5
I2C Timing Characterization
Typical Operating Circuit of section
4.2
, VDD = 2.4V to 3.6V, VDDIO = 1.71 to VDD, T
A
=25°C, unless
otherwise noted.
Parameters
Conditions
Min
Typical
Max
Units
Note s
I
2
C TIMING
I
2
C FAST-MODE
f
SCL
, SCL Clock Frequency
400
kHz
t
HD.STA
, (Repeated) START Condition Hold
Time
0.6
μs
t
LOW
, SCL Low Period
1.3
μs
t
HIGH
, SCL High Period
0.6
μs
t
SU.STA
, Repeated START Condition Setup
Time
0.6
μs
t
HD.DAT
, SDA Data Hold Time
0
μs
t
SU.DAT
, SDA Data Setup Time
100
ns
t
r
, SDA and SCL Rise Time
C
b
bus cap. from 10 to 400pF
20+0.1C
b
300
ns
t
f
, SDA and SCL Fall Time
C
b
bus cap. from 10 to 400pF
20+0.1C
b
300
ns
t
SU.STO
, STOP Condition Setup Time
0.6
μs
t
BUF
, Bus Free Time Betw een STOP and
START Condition
1.3
μs
C
b
, Capacitive Load for each Bus Line
< 400
pF
t
VD.DAT
, Data Valid Time
0.9
μs
t
VD.ACK
, Data Valid Acknowledge Time
0.9
μs
Table 6 I
2
C Timing Characteristics
Notes:
•
Timing Characteristics apply to both Primary and Auxiliary I2C Bus
•
Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in
sockets
I
2
C Bus Timing Diagram
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
3.6
SPI Timing Characterization
Typical Operating Circuit of section
4.2
, VDD = 2.4V to 3.6V, VDDIO = 1.71V to VDD, T
A
=25°C, unless
otherwise noted.
Parameters
Conditions
Min
Typical
Max
Units
Note s
SPI TIMING
f
SCLK
, SCLK Clock Frequency
1
MHz
t
LOW
, SCLK Low Period
400
ns
t
HIGH
, SCLK High Period
400
ns
t
SU.CS
, CS Setup Time
8
ns
t
HD.CS
, CS Hold Time
500
ns
t
SU.SDI
, SDI Setup Time
11
ns
t
HD.SDI
, SDI Hold Time
7
ns
t
VD.SDO
, SDO Valid Time
C
load
= 20pF
100
ns
t
HD.SDO
, SDO Hold Time
C
load
= 20pF
4
ns
t
DIS.SDO
, SDO Output Disable Time
50
ns
Table 7 SPI Timing Characteristics
Notes:
1.
Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
SPI Bus Timing Diagram
3.6.1
fSCLK = 20MHz
Parameters
Conditions
Min
Typical
Max
Units
SPI TIMING
f
SCLK
, SCLK Clock Frequency
0.9
20
MHz
t
LOW
, SCLK Low Period
-
-
ns
t
HIGH
, SCLK High Period
-
-
ns
t
SU.CS
, CS Setup Time
1
ns
t
HD.CS
, CS Hold Time
1
ns
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
t
SU.SDI
, SDI Setup Time
0
ns
t
HD.SDI
, SDI Hold Time
1
ns
t
VD.SDO
, SDO Valid Time
C
load
= 20pF
25
ns
t
DIS.SDO
, SDO Output Disable Time
25
ns
Table 8 fCLK = 20MHz
Note:
1.
Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
3.7
Absolute Maximum Ratings
Stress above those listed as "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.
Specification
Symbol
Conditions
MIN
MAX
Units
Supply Voltage
V
DD
-0.5
4.0
V
V
DDIO
-0.5
4.0
V
Acceleration
Any axis, unpow ered,
0.2ms duration
10,000
g
Temperature
Operating
-40
105
°C
Storage
-40
125
°C
ESD Tolerance
HBM
2
KV
MM
250
V
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
4 Applications Information
4.1
Pin Out and Signal Description
Pin Number
Pin Nam e
Pin Description
1
RESV
Reserved.
Connect to VDDIO.
7
AUX_CL
I
2
C Master serial clock, for connecting to external sensors
8
VDDIO
Digital I/O supply voltage
9
AD0 / SDO
I
2
C Slave Address LSB (AD0); SPI serial data output (SDO)
10
REGOUT
Regulator filter capacitor connection
11
FSYNC
Frame synchronization digital input. Connect to GND if unused.
12
INT
Interrupt digital output (totem pole or open-drain)
13
VDD
Pow er supply voltage and Digital I/O supply voltage
18
GND
Pow er supply ground
19
RESV
Reserved. Do not connect.
20
RESV
Reserved. Connect to GND.
21
AUX_DA
I
2
C master serial data, for connecting to external sensors
22
nCS
Chip select (SPI mode only)
23
SCL / SCLK
I
2
C serial clock (SCL); SPI serial clock (SCLK)
24
SDA / SDI
I
2
C serial data (SDA); SPI serial data input (SDI)
2 – 6, 14 - 17
NC
Not internally connected. May be used for PCB trace routing.
Table 9 Signal Descriptions
AUX_CL
VDDIO
AD0/SDO
REGOUT
FSYNC
INT
GND
SCL / SCLK
nCS
RESV
VDD
SDA / SDI
NC
AUX_DA
RESV
NC
NC
NC
RESV
NC
NC
NC
NC
NC
MPU-9250
1
2
3
4
5
6
13
18
17
16
15
14
7
8
9
10
11
12
24
23
22
21
20
19
Figure 1 Pin Out Diagram for MPU-9250 3.0x3.0x1.0mm QFN
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
4.2
Typical Operating Circuit
AUX_CL
VDDIO
AD0/SDO
REGOUT
FSYNC
INT
GND
SCL / SCLK
nCS
RESV
VDD
SDA / SDI
NC
2.4 – 3.3VDC
C2, 0.1
μ
F
C3, 10 nF
1.8 – 3.3VDC
SCL
VDDIO
SDA
AUX_DA
AD0
C1, 0.1
μ
F
RESV
NC
NC
NC
RESV
NC
NC
NC
NC
NC
MPU-9250
1
2
3
4
5
6
13
18
17
16
15
14
7
8
9
10
11
12
24
23
22
21
20
19
AUX_CL
VDDIO
AD0/SDO
REGOUT
FSYNC
INT
GND
SCL / SCLK
nCS
RESV
VDD
SDA / SDI
NC
2.4 – 3.3VDC
C2, 0.1
μ
F
C3, 10 nF
1.8 – 3.3VDC
SCLK
SDI
AUX_DA
SD0
C1, 0.1
μ
F
RESV
NC
NC
NC
RESV
NC
NC
NC
NC
NC
MPU-9250
1
2
3
4
5
6
13
18
17
16
15
14
7
8
9
10
11
12
24
23
22
21
20
19
nCS
(a)
(b)
Figure 2 MPU-9250 QFN Application Schematic: (a) I2C operation, (b) SPI operation
Note that the INT pin should be connected to a GPIO pin on the system processor that is capable of waking
the system processor from suspend mode.
4.3
Bill of Materials for External Components
Component
Label
Specification
Quantity
Regulator Filter Capacitor
C1
Ceramic, X7R, 0.1μF ±10%, 2V
1
VDD Bypass Capacitor
C2
Ceramic, X7R, 0.1μF ±10%, 4V
1
VDDIO Bypass Capacitor
C3
Ceramic, X7R, 10nF ±10%, 4V
1
Table 10 Bill of Materials
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
4.4
Block Diagram
MPU-9250
Charge
Pump
nCS
AD0 / SDO
SCL / SCLK
SDA / SDI
Temp Sensor
ADC
ADC
Z Gyro
ADC
Y Gyro
Digital Motion
Processor
(DMP)
FSYNC
Slave I2C and
SPI Serial
Interface
Master I2C
Serial
Interface
Serial
Interface
Bypass
Mux
AUX_CL
AUX_DA
INT
Interrupt
Status
Register
VDD
Bias & LDOs
GND
REGOUT
Z Accel
Y Accel
X Accel
ADC
ADC
ADC
ADC
X Gyro
Signal Conditioning
FIFO
User & Config
Registers
Sensor
Registers
VDDIO
Self
test
Self
test
Self
test
Self
test
Self
test
Self
test
X
Compass
Y
Compass
Z
Compass
ADC
ADC
ADC
Signal Conditioning
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
Revision: 1.0
Release Date: 01/17/2014
4.5
Overview
The MPU-9250 is comprised of the following key blocks and functions:
•
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
•
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
•
Three-axis MEMS magnetometer sensor with 16-bit ADCs and signal conditioning
•
Digital Motion Processor (DMP) engine
•
Primary I
2
C and SPI serial communications interfaces
•
Auxiliary I
2
C
serial interface for 3
rd
party sensors
•
Clocking
•
Sensor Data Registers
•
FIFO
•
Interrupts
•
Digital-Output Temperature Sensor
•
Gyroscope, Accelerometer and Magnetometer Self-test
•
Bias and LDO
•
Charge Pump
4.6
Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-9250 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X-, Y-, and Z- Axes.
When the gyros are rotated about any of the sense axes, the Coriolis Effect causes
a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered
to produce a voltage that is proportional to the angular rate.
This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis.
The full-scale range of the gyro sensors
may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps).
The ADC sample
rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable
low-pass filters enable a wide range of cut-off frequencies.
4.7
Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning
The MPU-9250's 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a
particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the
displacement differentially. The MPU-9250's architecture reduces the accelerometers' susceptibility to
fabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure
0
g
on the X- and Y-axes and +1
g
on the Z-axis. The accelerometers' scale factor is calibrated at the factory
and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing
digital outputs. The full scale range of the digital output can be adjusted to ±2
g
, ±4
g
, ±8
g
, or ±16
g
.
4.8
Three-Axis MEMS Magnetometer with 16-bit ADCs and Signal Conditioning
The 3-axis magnetometer uses highly sensitive Hall sensor technology. The magnetometer portion of the IC
incorporates magnetic sensors for detecting terrestrial magnetism in the X-, Y-, and Z- Axes, a sensor driving
circuit, a signal amplifier chain, and an arithmetic circuit for processing the signal from each sensor. Each
ADC has a 16-bit resolution and a full scale range of ±4800 μT.
4.9
Digital Motion Processor
The embedded Digital Motion Processor (DMP) is located within the MPU-9250 and offloads computation of
motion processing algorithms from the host processor. The DMP acquires data from accelerometers,
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MPU-9250 Product Specification
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gyroscopes, magnetometers and additional 3
rd
party sensors, and processes the data. The resulting data can
be read from the DMP's registers, or can be buffered in a FIFO. The DMP has access to one of the MPU's
external pins, which can be used for generating interrupts. This pin (pin 12) should be connected to a pin on
the host processor that can wake the host from suspend mode.
The purpose of the DMP is to offload both timing requirements and processing power from the host
processor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in order
to provide accurate results with low latency. This is required even if the application updates at a much lower
rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing should
still run at 200Hz. The DMP can be used as a tool in order to minimize power, simplify timing, simplify the
software architecture, and save valuable MIPS on the host processor for use in the application.
4.10 Primary I2C and SPI Serial Communications Interfaces
The MPU-9250 communicates to a system processor using either a SPI or an I
2
C serial interface. The MPU-
9250 always acts as a slave when communicating to the system processor. The LSB of the of the I
2
C slave
address is set by pin 9 (AD0).
4.11 Auxiliary I2C Serial Interface
The MPU-9250 has an auxiliary I
2
C bus for communicating to off-chip sensors. This bus has two operating
modes:
•
I
2
C Master Mode: The MPU-9250 acts as a master to any external sensors connected to the
auxiliary I
2
C bus
•
Pass-Through Mode: The MPU-9250 directly connects the primary and auxiliary I
2
C buses together,
allowing the system processor to directly communicate with any external sensors.
•
Note: AUX_DA and AUX_CL should be left unconnected if the Auxiliary I
2
C mode is not used.
Auxiliary I
2
C Bus Modes of Operation:
•
I
2
C Master Mode:
Allows the MPU-9250 to directly access the data registers of external digital
sensors, such as a magnetometer. In this mode, the MPU-9250 directly obtains data from auxiliary
sensors without intervention from the system applications processor.
For example, In I
2
C Master mode, the MPU-9250 can be configured to perform burst reads, returning
the following data from a magnetometer:
▪
X magnetometer data (2 bytes)
▪
Y magnetometer data (2 bytes)
▪
Z magnetometer data (2 bytes)
The I
2
C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor
can be configured to work single byte read/write mode.
•
Pass-Through Mode: Allows an external system processor to act as master and directly
communicate to the external sensors connected to the auxiliary I
2
C bus pins (AUX_DA and
AUX_CL). In this mode, the auxiliary I
2
C bus control logic (3
rd
party sensor interface block) of the
MPU-9250 is disabled, and the auxiliary I
2
C pins AUX_DA and AUX_CL are connected to the main
I
2
C bus through analog switches internally.
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Document Number: PS-MPU-9250A-01
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Pass-Through mode is useful for configuring the external sensors, or for keeping the MPU-9250 in a
low-power mode when only the external sensors are used. In this mode, the system processor can
still access MPU-9250 data through the I
2
C interface.
Pass-Through mode is also used to access the AK8963 magnetometer directly from the host.
In this
configuration the slave address for the AK8963 is 0X0C or 12 decimal.
Auxiliary I
2
C Bus IO Logic Levels
For MPU-9250, the logic level of the auxiliary I
2
C bus is VDDIO. For further information regarding the MPU-
9250 logic levels, please refer to Section 10.2.
4.12 Self-Test
Please refer to the register map document for more details on self-test.
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each
measurement axis can be activated by means of the gyroscope and accelerometer self-test registers
(registers 13 to 16).
When the self-test is activated, the electronics cause the sensors to be actuated and produce an output
signal. The output signal is used to observe the self-test response.
The self-test response is defined as follows:
Self-test response = Sensor output with self-test enabled – Sensor output without self-test enabled
When the value of the self-test response is within the appropriate limits, the part has passed self-test.
When
the self-test response exceeds the appropriate values, the part is deemed to have failed self-test. It is
recommended to use InvenSense MotionApps software for executing self-test.
Further details, including the
self-test limits are included in the MPU-9250 Self-Test applications note available from InvenSense.
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Document Number: PS-MPU-9250A-01
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4.13 MPU-9250 Solution Using I2C Interface
In the figure below, the system processor is an I
2
C master to the MPU-9250. In addition, the MPU-9250 is an
I
2
C master to the optional external 3
rd
party sensor. The MPU-9250 has limited capabilities as an I
2
C Master,
and depends on the system processor to manage the initial configuration of any auxiliary sensors. The MPU-
9250 has an interface bypass multiplexer, which connects the system processor I
2
C bus (SDA and SCL)
directly to the auxiliary sensor I
2
C bus (AUX_DA and AUX_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
should be disabled so that the MPU-9250 auxiliary I
2
C master can take control of the sensor I
2
C bus and
gather data from the auxiliary sensors.
The INT pin should be connected to a GPIO on the system processor
that can wake the system from suspend mode.
MPU-9250
AD0
SCL
SDA/SDI
Digital
Motion
Processor
(DMP)
Sensor
Master I
2
C
Serial
Interface
AUX_CL
AUX_DA
Interrupt
Status
Register
INT
VDD
Bias & LDOs
GND
REGOUT
FIFO
User & Config
Registers
Sensor
Register
Factory
Calibration
Slave I
2
C
or SPI
Serial
Interface
3
rd
party
sensor
SCL
SDA
System
Processor
Interface
Bypass
Mux
SCL
SDA
VDD or GND
I
2
C Processor Bus: for reading all
sensor data from MPU and for
configuring external sensors (i.e.
compass in this example)
Interface bypass mux allows
direct configuration of
compass by system processor
Optional
Sensor I
2
C Bus: for
configuring and reading
from external sensors
VDDIO
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Document Number: PS-MPU-9250A-01
Revision: 1.0
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4.14 MPU-9250 Solution Using SPI Interface
In the figure below, the system processor is a SPI master to the MPU-9250. The CS, SDO, SCLK, and SDI
signals are used for SPI communications. Because these SPI pins are shared with the I
2
C slave pins, the
system processor cannot access the auxiliary I
2
C bus through the interface bypass multiplexer, which
connects the processor I
2
C interface pins to the sensor I
2
C interface pins.
Since the MPU-9250 has limited capabilities as an I
2
C Master, and depends on the system processor to
manage the initial configuration of any auxiliary sensors, another method must be used for programming the
sensors on the auxiliary sensor I
2
C bus (AUX_DA and AUX_CL).
When using SPI communications between the MPU-9250 and the system processor, configuration of
devices on the auxiliary I
2
C sensor bus can be achieved by using I
2
C Slaves 0-4 to perform read and write
transactions on any device and register on the auxiliary I
2
C bus. The I
2
C Slave 4 interface can be used to
perform only single byte read and write transactions.
Once the external sensors have been configured, the MPU-9250 can perform single or multi-byte reads
using the sensor I
2
C bus. The read results from the Slave 0-3 controllers can be written to the FIFO buffer as
well as to the external sensor registers.
The INT pin should be connected to a GPIO on the system processor capable of waking the processor from
suspend
For further information regarding the control of the MPU-9250's auxiliary I
2
C interface, please refer to the
MPU-9250 Register Map and Register Descriptions document.
MPU-9250
SDO
SCLK
SDI
Digital
Motion
Processor
(DMP)
Sensor
Master I
2
C
Serial
Interface
Interrupt
Status
Register
INT
FIFO
Config
Register
Sensor
Register
Factory
Calibration
nCS
Slave I
2
C
or SPI
Serial
Interface
System
Processor
Interface
Bypass
Mux
SDI
SCLK
SDO
nCS
Processor SPI Bus: for reading all
data from MPU and for configuring
MPU and external sensors
AUX_CL
AUX_DA
3
rd
party
sensor
SCL
SDA
Optional
I
2
C Master performs
read and write
transactions on
Sensor I
2
C bus.
Sensor I
2
C Bus: for
configuring and
reading data from
external sensors
VDD
Bias & LDOs
GND
REGOUT
VDDIO
4.15 Clocking
The MPU-9250 has a flexible clocking scheme, allowing a variety of internal clock sources to be used for the
internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the
DMP, and various control circuits and registers.
An on-chip PLL provides flexibility in the allowable inputs for
generating this clock.
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MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01
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Allowable internal sources for generating the internal clock are:
•
An internal relaxation oscillator
•
Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)
Selection of the source for generating the internal synchronous clock depends on the requirements for power
consumption and clock accuracy.
These requirements will most likely vary by mode of operation. For
example, in one mode, where the biggest concern is power consumption, the user may wish to operate the
Digital Motion Processor of the MPU-9250 to process accelerometer data, while keeping the gyros off. In this
case, the internal relaxation oscillator is a good clock choice.
However, in another mode, where the gyros
are active, selecting the gyros as the clock source provides for a more accurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed
by the Digital Motion Processor (and by extension, by any processor).
There are also start-up conditions to consider. When the MPU-9250 first starts up, the device uses its
internal clock until programmed to operate from another source.
This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.
4.16 Sensor Data Registers
The sensor data registers contain the latest gyroscope, accelerometer, magnetometer, auxiliary sensor, and
temperature measurement data.
They are read-only registers, and are accessed via the serial interface.
Data from these registers may be read anytime.
4.17 FIFO
The MPU-9250 contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input.
A FIFO counter
keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads.
The interrupt function may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-9250 Register Map and Register
Descriptions document.
4.18 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt.
Items that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) new data is available to be read (from the FIFO and Data registers); (3) accelerometer event
interrupts; and (4) the MPU-9250 did not receive an acknowledge from an auxiliary sensor on the secondary
I
2
C bus.
The interrupt status can be read from the Interrupt Status register.
The INT pin should be connected to a pin on the host processor capable of waking that processor from
suspend.
For further information regarding interrupts, please refer to the MPU-9250 Register Map and Register
Descriptions document.
4.19 Digital-Output Temperature Sensor
An on-chip temperature sensor and ADC are used to measure the MPU-9250 die temperature.
The readings
from the ADC can be read from the FIFO or the Sensor Data registers.
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4.20 Bias and LDO
The bias and LDO section generates the internal supply and the reference voltages and currents required by
the MPU-9250. Its two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The
LDO output is bypassed by a capacitor at REGOUT. For further details on the capacitor, please refer to the
Bill of Materials for External Components.
4.21 Charge Pump
An on-chip charge pump generates the high voltage required for the MEMS oscillators.
4.22 Standard Power Mode
The following table lists the user-accessible power modes for MPU-9250.
Mode
Name
Gyro
Accel
Magnetometer
DMP
1
Sleep Mode
Off
Off
Off
Off
2
Standby Mode
Drive On
Off
Off
Off
3
Low-Power Accelerometer Mode
Off
Duty-Cycled
Off
On or Off
4
Low-Noise Accelerometer Mode
Off
On
Off
On or Off
5
Gyroscope Mode
On
Off
Off
On or Off
6
Magnetometer Mode
Off
Off
On
On or Off
7
Accel + Gyro Mode
On
On
Off
On or Off
8
Accel + Magnetometer Mode
Off
On
On
On or Off
9
9-Axis Mode
On
On
On
On or Off
Notes:
1.
Power consumption for individual modes can be found in Electrical Characteristics section.
4.23 Power Sequencing Requirements and Power on Reset
During power up and in normal operation, VDDIO must not exceed VDD.
During power up, VDD and VDDIO
must be monotonic ramps.
As stated in Table 4, the minimum VDD rise time is 0.1ms and the maximum rise
time is 100 ms.
Valid gyroscope data is available 35 ms (typical) after VDD has risen to its final voltage from
a cold start and valid accelerometer data is available 30 ms (typical) after VDD has risen to its final voltage
assuming a 1ms VDD ramp from cold start.
Magnetometer data is valid 7.3ms (typical) after VDD has risen
to its final voltage value from a cold start.
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5 Advanced Hardware Features
The MPU-9250 includes advanced hardware features that can be enabled and disabled through simple
hardware register settings.
The advanced hardware features are not initially enabled after device power up.
These features must be individually enabled and configured. These advanced hardware features enable the
following motion-based functions without using an external microprocessor:
•
Low Power Quaternion (3-Axis Gyro & 6-Axis Gyro + Accel)
•
Android Orientation (A low-power implementation of Android's screen rotation algorithm)
•
Tap (detects the tap gesture)
•
Pedometer
•
Significant Motion Detection
To ensure significant motion detection can operate properly, the INT pin should be connected to a GPIO pin
on the host processor that can wake that processor from suspend mode.
Note:
Android Orientation is compliant to the Ice Cream Sandwich definition of the function.
For further details on advanced hardware features please refer to the MPU-9250 Register Map.
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6 Programmable Interrupts
The MPU-9250 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Table of Interrupt Sources
Interrupt Name
Module
Motion Detection
Motion
FIFO Overflow
FIFO
Data Ready
Sensor Registers
I
2
C Master errors: Lost Arbitration, NACKs
I
2
C Master
I
2
C Slave 4
I
2
C Master
For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU-
9250 Register Map and Register Descriptions document. Some interrupt sources are explained below.
6.1
Wake-on-Motion Interrupt
The MPU-9250 provides motion detection capability. A qualifying motion sample is one where the high
passed sample from any axis has an absolute value exceeding a user-programmable threshold. The
following flowchart explains how to configure the Wake-on-Motion Interrupt. For further details on individual
registers, please refer to the MPU-9250 Registers Map and Registers Description document.
In order to properly enable motion interrupts, the INT pin should be connected to a GPIO on the system
processor that is capable of waking up the system processor.
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Figure 3. Wake-on-Motion Interrupt Configuration
Configuration Wake-on-Motion Interrupt using low power Accel mode
Make Sure Accel is running:
•
In PWR_MGMT_1 (0x6B) make CYCLE =0, SLEEP = 0
and STANDBY = 0
•
In PWR_MGMT_2 (0x6C) set DIS_XA, DIS_YA, DIS_ZA = 0 and DIS_XG, DIS_YG, DIS_ZG = 1
Enable Motion Interrupt:
•
In INT_ENABLE (0x38), set the whole register to 0x40 to enable motion interrupt only.
Enable Accel Hardware Intelligence:
•
In MOT_DETECT_CTRL (0x69), set ACCEL_INTEL_EN = 1 and ACCEL_INTEL_MODE
= 1
Set Motion Threshold:
•
In WOM_THR (0x1F), set the WOM_Threshold [7:0] to 1~255 LSBs (0~1020mg)
Set Frequency of Wake-up:
•
In LP_ACCEL_ODR (0x1E), set Lposc_clksel [3:0] = 0.24Hz ~ 500Hz
Enable Cycle Mode (Accel Low Power Mode):
•
In PWR_MGMT_1 (0x6B) make CYCLE =1
Motion Interrupt Configuration Completed
Set Accel LPF setting to 184 Hz Bandwidth:
▪
In ACCEL_CONFIG 2 (0x1D) set ACCEL_FCHOICE_B = 1 and A_DLPFCFG[2:]=1(b001)
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7 Digital Interface
7.1
I2C and SPI Serial Interfaces
The internal registers and memory of the MPU-9250 can be accessed using either I
2
C at 400 kHz or SPI at
1MHz. SPI operates in four-wire mode.
Serial Interface
Pin Number
Pin Nam e
Pin Description
8
VDDIO
Digital I/O supply voltage.
9
AD0 / SDO
I
2
C Slave Address LSB (AD0); SPI serial data output (SDO)
23
SCL / SCLK
I
2
C serial clock (SCL); SPI serial clock (SCLK)
24
SDA / SDI
I
2
C serial data (SDA); SPI serial data input (SDI)
Note:
To prevent switching into I
2
C mode when using SPI, the I
2
C interface should be disabled by setting the
I2C_IF_DIS
configuration bit. Setting this bit should be performed immediately after waiting for the time
specified by the "Start-Up Time for Register Read/Write" in Section 6.3.
For further information regarding the
I2C_IF_DIS
bit, please refer to the MPU-9250 Register Map and
Register Descriptions document.
7.2
I2C Interface
I
2
C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the
lines are open-drain and bi-directional. In a generalized I
2
C interface implementation, attached devices can
be a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The MPU-9250 always operates as a slave device when communicating to the system processor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-9250 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is
determined by the logic level on pin AD0. This allows two MPU-9250s to be connected to the same I
2
C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic
low) and the address of the other should be b1101001 (pin AD0 is logic high).
7.3
I2C Communications Protocol
START (S) and STOP (P) Conditions
Communication on the I
2
C bus starts when the master puts the START condition (S) on the bus, which is
defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is
considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
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SDA
SCL
S
START condition
STOP condition
P
START and STOP Conditions
Data Format / Acknowledge
I
2
C data bytes are defined to be 8-bits long.
There is no restriction to the number of bytes transmitted per
data transfer.
Each byte transferred must be followed by an acknowledge (ACK) signal.
The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold SCL LOW, thus forcing the master into a wait state.
Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).
DATA OUTPUT BY
TRANSMITTER (SDA)
DATA OUTPUT BY
RECEIVER (SDA)
SCL FROM
MASTER
START
condition
clock pulse for
acknowledgement
acknowledge
not acknowledge
1
2
8
9
Acknowledge on the I
2
C Bus
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Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address
followed by an 8
th
bit, the read/write bit. The read/write bit indicates whether the master is receiving data from
or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK) from the slave device.
Each byte transferred must be followed by an acknowledge bit.
To
acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line.
Data transmission is always terminated by the master with a STOP condition (P), thus freeing the
communications line.
However, the master can generate a repeated START condition (Sr), and address
another slave without first generating a STOP condition (P).
A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
SDA
START
condition
SCL
ADDRESS
R/W
ACK
DATA
ACK
DATA
ACK
STOP
condition
S
P
1 – 7
8
9
1 – 7
8
9
1 – 7
8
9
Complete I
2
C Data Transfer
To write the internal MPU-9250 registers, the master transmits the start condition (S), followed by the I
2
C
address and the write bit (0). At the 9
th
clock cycle (when the clock is high), the MPU-9250 acknowledges the
transfer. Then the master puts the register address (RA) on the bus. After the MPU-9250 acknowledges the
reception of the register address, the master puts the register data onto the bus.
This is followed by the ACK
signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the
MPU-9250 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.
Single-Byte Write Sequence
Burst Write Sequence
Master
S
AD+W
RA
DATA
P
Slave
ACK
ACK
ACK
Master
S
AD+W
RA
DATA
DATA
P
Slave
ACK
ACK
ACK
ACK
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To read the internal MPU-9250 registers, the master sends a start condition, followed by the I
2
C address and
a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the
MPU-9250, the master transmits a start signal followed by the slave address and read bit. As a result, the
MPU-9250 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK)
signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the
9
th
clock cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence
Burst Read Sequence
7.4
I2C Terms
Signal
Description
S
Start Condition: SDA goes from high to low while SCL is high
AD
Slave I
2
C address
W
Write bit (0)
R
Read bit (1)
ACK
Acknowledge: SDA line is low while the SCL line is high at the
9
th
clock cycle
NACK
Not-Acknowledge: SDA line stays high at the 9
th
clock cycle
RA
MPU-9250 internal register address
DATA
Transmit or received data
P
Stop condition: SDA going from low to high while SCL is high
Master
S
AD+W
RA
S
AD+R
NACK
P
Slave
ACK
ACK
ACK
DATA
Master
S
AD+W
RA
S
AD+R
ACK
NACK
P
Slave
ACK
ACK
ACK
DATA
DATA
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7.5
SPI Interface
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-9250
always operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial
Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select
(CS) line from the master.
CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line
is active at a time, ensuring that only one slave is selected at any given time. The CS lines of the non-
selected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state
so that they do not interfere with any active devices.
SPI Operational Features
1.
Data is delivered MSB first and LSB last
2.
Data is latched on the rising edge of SCLK
3.
Data should be transitioned on the falling edge of SCLK
4.
The maximum frequency of SCLK is 1MHz
5.
SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data.
The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address.
In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB
LSB
R/W
A6
A5
A4
A3
A2
A1
A0
SPI Data format
MSB
LSB
D7
D6
D5
D4
D3
D2
D1
D0
6.
Supports Single or Burst Read/Writes.
Typical SPI Master / Slave Configuration
SPI Master
SPI Slave 1
SPI Slave 2
/CS1
/CS2
SCLK
SDI
SDO
/CS
SCLK
SDI
SDO
/CS
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8 Serial Interface Considerations
8.1
MPU-9250 Supported Interfaces
The MPU-9250 supports I
2
C communications on both its primary (microprocessor) serial interface and its
auxiliary interface.
The MPU-9250's I/O logic levels are set to be VDDIO.
The figure below depicts a sample circuit of MPU-9250 with a third party sensor attached to the auxiliary I
2
C
bus. It shows the relevant logic levels and voltage connections.
Note: Actual configuration will depend on the auxiliary sensors used.
I/O Levels and Connections
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9 Assembly
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems
(MEMS) devices packaged in quad flat no-lead package (QFN) surface mount integrated circuits.
9.1
Orientation of Axes
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (
•
) in the figure.
MPU-9250
+Z
+X
+Y
+Z
+Y
+X
Figure 4. Orientation of Axes of Sensitivity and Polarity of Rotation for Accelerometer and Gyroscope
MPU-9250
+Z
+X
+Y
Figure 5. Orientation of Axes of Sensitivity for Compass
9.2
Package Dimensions
24 Lead QFN (3x3x1) mm NiPdAu Lead-frame finish
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Document Number: PS-MPU-9250A-01
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DIMENSIONS IN
MILLIMETERS
SYMBOLS
DESCRIPTION
MIN
NOM
MAX
A
Package thickness
0.95
1.00
1.05
A1
Lead finger
(pad)
seating height
0.00
0.02
0.05
b
Lead
finger (pad)
width
0.15
0.20
0.25
c
Lead frame
(pad)
height
---
0.15 REF
---
D
Package width
2.90
3.00
3.10
D2
Exposed pad width
1.65
1.70
1.75
E
Package length
2.90
3.00
3.10
E2
Exposed pad length
1.49
1.54
1.59
e
Lead finger-finger (pad-pad) pitch
---
0.40
---
f (e-b)
Lead-lead (Pad-Pad) space
0.15
0.20
0.25
K
Lead (pad) to Exposed Pad Space
---
0.35 REF
---
L
Lead (pad) length
0.25
0.30
0.35
R
Lead (pad) corner radius
0.075
REF
---
s
Corner lead (pad) outer radius to corner
lead outer radius
---
0.25 REF
---
y
0.00
---
0.075
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10 Part Number Package Marking
The part number package marking for MPU-9250 devices is summarized below:
Part Number
Part Number Package Marking
MPU-9250
MP92
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11 Reliability
11.1 Qualification Test Policy
InvenSense's products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-9250 followed the JEDEC JESD 47I Standard, "Stress-Test-Driven
Qualification of Integrated Circuits," with the individual tests described below.
11.2 Qualification Test Plan
Accelerated Life Tests
TEST
Method/Condition
Lot
Quantity
Sample
/ Lot
Acc /
Reject
Criteria
(HTOL/LFR)
High Temperature Operating Life
JEDEC JESD22-A108D
Dynamic, 3.63V biased,
Tj>125°C
[read-points: 168, 500, 1000 hours]
3
77
(0/1)
(HAST)
Highly Accelerated Stress Test
(1)
JEDEC JESD22-A118A
Condition A, 130°C, 85%RH, 33.3 psia., unbiased
[read-point: 96 hours]
3
77
(0/1)
(HTS)
High Temperature Storage Life
JEDEC JESD22-A103D
Condition A, 125°C Non-Bias Bake
[read-points: 168, 500, 1000 hours]
3
77
(0/1)
Device Component Level Tests
TEST
Method/Condition
Lot
Quantity
Sample
/ Lot
Acc /
Reject
Criteria
(ESD-HBM)
ESD-Human Body Model
JEDEC JS-001-2012
(2KV)
1
3
(0/1)
(ESD-MM)
ESD-Machine Model
JEDEC JESD22-A115C
(250V)
1
3
(0/1)
(ESD-CDM)
ESD-Charged Device Model
JEDEC JESD22-C101E
(500V)
1
3
(0/1)
(LU)
Latch Up
JEDEC JESD-78D
Class II (2), 125°C; ±100mA
1.5X Vdd Over-voltage
1
6
(0/1)
(MS)
Mechanical Shock
JEDEC JESD22-B104C, Mil-Std-883, Method
2002.5 Cond. E, 10,000
g's
, 0.2ms,
±X, Y, Z – 6 directions, 5 times/direction
3
5
(0/1)
(VIB)
Vibration
JEDEC JESD22-B103B
Variable Frequency (random), Cond. B, 5-500Hz,
X, Y, Z ± 4 times/direction
1
5
(0/1)
(TC)
Temperature Cycling
(1)
JEDEC JESD22-A104D
Condition G [-40°C to +125°C],
Soak Mode 2 [5']
[read-Point: 1000 cycles]
3
77
(0/1)
(1)
Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
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12 Reference
Please refer to "InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)" for the following
information:
•
Manufacturing Recommendations
o
Assembly Guidelines and Recommendations
o
PCB Design Guidelines and Recommendations
o
MEMS Handling Instructions
o
ESD Considerations
o
Reflow Specification
o
Storage Specifications
o
Package Marking Specification
o
Tape & Reel Specification
o
Reel & Pizza Box Label
o
Packaging
o
Representative Shipping Carton Label
•
Compliance
o
Environmental Compliance
o
DRC Compliance
o
Compliance Declaration Disclaimer
This information furnished by InvenSense is believed to be accurate and reliable. How ever, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, w ithout prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask w ork and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies w ith which they are associated.
©2014 InvenSense, Inc. All rights reserved.
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