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Compared to a packaged die where the bond wires are connected to the top of the die, with Chip-On-Glass manufacturing the chip is flipped upside down. After conventional IC fabrication the bonding pads are plated with gold bumps which allow them to be connected to contact pads on the glass. Now the connections, gold bumps in this case, are below the die.
PTM Published on: 2011-11-02
India